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Discrete Semiconductor Products

UT6MA3TCR

Active
Rohm Semiconductor

MOSFET, N AND P-CH, 20V, 5.5A, DFN2020

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Product thumbnail image
Discrete Semiconductor Products

UT6MA3TCR

Active
Rohm Semiconductor

MOSFET, N AND P-CH, 20V, 5.5A, DFN2020

Technical Specifications

Parameters and characteristics for this part

SpecificationUT6MA3TCR
ConfigurationN and P-Channel
Current - Continuous Drain (Id) @ 25°C5 A, 5.5 A
Drain to Source Voltage (Vdss)20 V
Gate Charge (Qg) (Max) @ Vgs6.5 nC
Input Capacitance (Ciss) (Max) @ Vds460 pF
Mounting TypeSurface Mount
Operating Temperature [Max]150 °C
Operating Temperature [Min]-55 °C
Package / Case6-PowerUDFN
Power - Max [Max]2 W
Rds On (Max) @ Id, Vgs59 mOhm
Supplier Device PackageHUML2020L8
Vgs(th) (Max) @ Id1.5 V

Pricing

Prices provided here are for design reference only. For realtime values and availability, please visit the distributors directly

DistributorPackageQuantity$
DigikeyN/A 5823$ 1.35
NewarkEach (Supplied on Cut Tape) 1$ 1.32
10$ 0.87
25$ 0.78
50$ 0.68
100$ 0.58
300$ 0.52
500$ 0.46
1000$ 0.41

Description

General part information

UT6MA3 Series

UT6MA3 is Low on-resistance Middle Power MOSFET for switching application.

Documents

Technical documentation and resources

How to Use LTspice® Models: Tips for Improving Convergence

Schematic Design & Verification

Part Explanation

Application Note

Compliance of the RoHS directive

Environmental Data

What is a Thermal Model? (Transistor)

Thermal Design

PCB Layout Thermal Design Guide

Thermal Design

How to Use LTspice® Models

Schematic Design & Verification

List of Transistor Package Thermal Resistance

Thermal Design

Moisture Sensitivity Level - Transistors

Package Information

UT6MA3 Data Sheet

Data Sheet

Temperature derating method for Safe Operating Area (SOA)

Schematic Design & Verification

Calculation of Power Dissipation in Switching Circuit

Schematic Design & Verification

Method for Calculating Junction Temperature from Transient Thermal Resistance Data

Thermal Design

MOSFET Gate Resistor Setting for Motor Driving

Technical Article

About Flammability of Materials

Environmental Data

Two-Resistor Model for Thermal Simulation

Thermal Design

MOSFET Gate Drive Current Setting for Motor Driving

Technical Article

Anti-Whisker formation - Transistors

Package Information

Impedance Characteristics of Bypass Capacitor

Schematic Design & Verification

Types and Features of Transistors

Application Note

Method for Monitoring Switching Waveform

Schematic Design & Verification

Notes for Temperature Measurement Using Thermocouples

Thermal Design

P-channel Power MOSFETs selection guide

Technical Article

Overview of ROHM's Simulation Models(for ICs and Discrete Semiconductors)

Technical Article

Notes for Calculating Power Consumption:Static Operation

Thermal Design

About Export Regulations

Export Information

Certificate of not containing SVHC under REACH Regulation

Environmental Data

What Is Thermal Design

Thermal Design

Inner Structure

Package Information

Explanation for Marking

Package Information

ESD Data

Characteristics Data

Measurement Method and Usage of Thermal Resistance RthJC

Thermal Design

Importance of Probe Calibration When Measuring Power: Deskew

Schematic Design & Verification

How to Create Symbols for PSpice Models

Models

Basics of Thermal Resistance and Heat Dissipation

Thermal Design

Condition of Soldering / Land Pattern Reference

Package Information

Notes for Temperature Measurement Using Forward Voltage of PN Junction

Thermal Design

Taping Information

Package Information

Precautions When Measuring the Rear of the Package with a Thermocouple

Thermal Design

Package Dimensions

Package Information