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QH8KE5TCR
Discrete Semiconductor Products

QH8KE5TCR

Active
Rohm Semiconductor

MOSFET, DUAL N-CH, 100V, 2A, TSMT ROHS COMPLIANT: YES

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QH8KE5TCR
Discrete Semiconductor Products

QH8KE5TCR

Active
Rohm Semiconductor

MOSFET, DUAL N-CH, 100V, 2A, TSMT ROHS COMPLIANT: YES

Technical Specifications

Parameters and characteristics for this part

SpecificationQH8KE5TCR
Configuration2 N-Channel (Dual)
Current - Continuous Drain (Id) @ 25°C2 A
Drain to Source Voltage (Vdss)100 V
Gate Charge (Qg) (Max) @ Vgs [Max]2.8 nC
Input Capacitance (Ciss) (Max) @ Vds90 pF
Mounting TypeSurface Mount
Operating Temperature150 °C
Power - Max [Max]1.5 W
Rds On (Max) @ Id, Vgs202 mOhm
Supplier Device PackageTSMT8
TechnologyMOSFET (Metal Oxide)
Vgs(th) (Max) @ Id2.5 V

Pricing

Prices provided here are for design reference only. For realtime values and availability, please visit the distributors directly

DistributorPackageQuantity$
DigikeyN/A 2718$ 1.04
NewarkEach (Supplied on Cut Tape) 1$ 0.66
10$ 0.58
25$ 0.52
50$ 0.45
100$ 0.39
250$ 0.37
500$ 0.34
1000$ 0.31

Description

General part information

QH8KE5 Series

The Power MOSFET QH8KE5 is suitable for switching power supply and motor drive.

Documents

Technical documentation and resources

Calculation of Power Dissipation in Switching Circuit

Schematic Design & Verification

Importance of Probe Calibration When Measuring Power: Deskew

Schematic Design & Verification

Measurement Method and Usage of Thermal Resistance RthJC

Thermal Design

Temperature derating method for Safe Operating Area (SOA)

Schematic Design & Verification

Basics of Thermal Resistance and Heat Dissipation

Thermal Design

Method for Calculating Junction Temperature from Transient Thermal Resistance Data

Thermal Design

List of Transistor Package Thermal Resistance

Thermal Design

Certificate of not containing SVHC under REACH Regulation

Environmental Data

Notes for Temperature Measurement Using Thermocouples

Thermal Design

Moisture Sensitivity Level - Transistors

Package Information

Taping Information

Package Information

Explanation for Marking

Package Information

Overview of ROHM's Simulation Models(for ICs and Discrete Semiconductors)

Technical Article

Notes for Temperature Measurement Using Forward Voltage of PN Junction

Thermal Design

P-channel Power MOSFETs selection guide

Technical Article

Types and Features of Transistors

Application Note

Method for Monitoring Switching Waveform

Schematic Design & Verification

How to Use LTspice® Models

Schematic Design & Verification

Package Dimensions

Package Information

Compliance of the RoHS directive

Environmental Data

About Export Regulations

Export Information

Anti-Whisker formation - Transistors

Package Information

What is a Thermal Model? (Transistor)

Thermal Design

What Is Thermal Design

Thermal Design

MOSFET Gate Resistor Setting for Motor Driving

Technical Article

Part Explanation

Application Note

Precautions When Measuring the Rear of the Package with a Thermocouple

Thermal Design

Impedance Characteristics of Bypass Capacitor

Schematic Design & Verification

About Flammability of Materials

Environmental Data

How to Use LTspice® Models: Tips for Improving Convergence

Schematic Design & Verification

Two-Resistor Model for Thermal Simulation

Thermal Design

Notes for Calculating Power Consumption:Static Operation

Thermal Design

MOSFET Gate Drive Current Setting for Motor Driving

Technical Article

QH8KE5 ESD Data

Characteristics Data

PCB Layout Thermal Design Guide

Thermal Design

QH8KE5 Data Sheet

Data Sheet

Condition of Soldering / Land Pattern Reference

Package Information