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RQ5G060BGTCL
Discrete Semiconductor Products

RQ5G060BGTCL

Active
Rohm Semiconductor

MOSFET, N-CHANNEL, 40V, 6A, SOT-346T ROHS COMPLIANT: YES

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RQ5G060BGTCL
Discrete Semiconductor Products

RQ5G060BGTCL

Active
Rohm Semiconductor

MOSFET, N-CHANNEL, 40V, 6A, SOT-346T ROHS COMPLIANT: YES

Technical Specifications

Parameters and characteristics for this part

SpecificationRQ5G060BGTCL
Current - Continuous Drain (Id) @ 25°C6 A
Drain to Source Voltage (Vdss)40 V
Drive Voltage (Max Rds On, Min Rds On)10 V, 4.5 V
FET TypeN-Channel
Gate Charge (Qg) (Max) @ Vgs [Max]10.6 nC
Input Capacitance (Ciss) (Max) @ Vds [Max]530 pF
Mounting TypeSurface Mount
Operating Temperature150 °C
Package / CaseSC-96
Power Dissipation (Max) [Max]700 mW
Rds On (Max) @ Id, Vgs20.6 mOhm
Supplier Device PackageTSMT3
TechnologyMOSFET (Metal Oxide)
Vgs (Max)20 V
Vgs(th) (Max) @ Id2.5 V

Pricing

Prices provided here are for design reference only. For realtime values and availability, please visit the distributors directly

DistributorPackageQuantity$
DigikeyN/A 2780$ 0.93
NewarkEach (Supplied on Cut Tape) 1$ 1.05
10$ 0.63
25$ 0.53
50$ 0.46
100$ 0.40
250$ 0.34
500$ 0.30
1000$ 0.28

Description

General part information

RQ5G060BG Series

RQ5G060BG is a power MOSFET with low on-resistance and small surface mount package, suitable for switching and motor drives.

Documents

Technical documentation and resources

What is a Thermal Model? (Transistor)

Thermal Design

Notes for Calculating Power Consumption:Static Operation

Thermal Design

Part Explanation

Application Note

Temperature derating method for Safe Operating Area (SOA)

Schematic Design & Verification

Overview of ROHM's Simulation Models(for ICs and Discrete Semiconductors)

Technical Article

Taping Information

Package Information

PCB Layout Thermal Design Guide

Thermal Design

Calculation of Power Dissipation in Switching Circuit

Schematic Design & Verification

How to Use LTspice® Models: Tips for Improving Convergence

Schematic Design & Verification

Impedance Characteristics of Bypass Capacitor

Schematic Design & Verification

Method for Calculating Junction Temperature from Transient Thermal Resistance Data

Thermal Design

Package Dimensions

Package Information

How to Use LTspice® Models

Schematic Design & Verification

Anti-Whisker formation - Transistors

Package Information

About Flammability of Materials

Environmental Data

RQ5G060BG Data Sheet

Data Sheet

Compliance of the RoHS directive

Environmental Data

MOSFET Gate Drive Current Setting for Motor Driving

Technical Article

What Is Thermal Design

Thermal Design

Types and Features of Transistors

Application Note

Precautions When Measuring the Rear of the Package with a Thermocouple

Thermal Design

MOSFET Gate Resistor Setting for Motor Driving

Technical Article

Certificate of not containing SVHC under REACH Regulation

Environmental Data

Explanation for Marking

Package Information

About Export Regulations

Export Information

List of Transistor Package Thermal Resistance

Thermal Design

RQ5G060BG ESD Data

Characteristics Data

Condition of Soldering / Land Pattern Reference

Package Information

Notes for Temperature Measurement Using Forward Voltage of PN Junction

Thermal Design

Importance of Probe Calibration When Measuring Power: Deskew

Schematic Design & Verification

Basics of Thermal Resistance and Heat Dissipation

Thermal Design

Two-Resistor Model for Thermal Simulation

Thermal Design

Method for Monitoring Switching Waveform

Schematic Design & Verification

Measurement Method and Usage of Thermal Resistance RthJC

Thermal Design

Moisture Sensitivity Level - Transistors

Package Information

Notes for Temperature Measurement Using Thermocouples

Thermal Design