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BAS21VMTE-17
Discrete Semiconductor Products

BAS21VMTE-17

Active
Rohm Semiconductor

SMALL SIGNAL DIODE, SINGLE, 250 V, 200 MA, 1.25 V, 50 NS, 2 A

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BAS21VMTE-17
Discrete Semiconductor Products

BAS21VMTE-17

Active
Rohm Semiconductor

SMALL SIGNAL DIODE, SINGLE, 250 V, 200 MA, 1.25 V, 50 NS, 2 A

Technical Specifications

Parameters and characteristics for this part

SpecificationBAS21VMTE-17
Capacitance @ Vr, F2.5 pF
Current - Average Rectified (Io)200 mA
Current - Reverse Leakage @ Vr100 nA
Mounting TypeSurface Mount
Operating Temperature - Junction [Max]150 °C
Package / CaseSC-90, SOD-323F
Reverse Recovery Time (trr)50 ns
Speed200 mA
SpeedAny Speed
Supplier Device PackageUMD2
TechnologyStandard
Voltage - DC Reverse (Vr) (Max) [Max]200 V
Voltage - Forward (Vf) (Max) @ If1.25 V

Pricing

Prices provided here are for design reference only. For realtime values and availability, please visit the distributors directly

DistributorPackageQuantity$
DigikeyN/A 1$ 0.24

Description

General part information

BAS21VM Series

BAS21VM is Switching Diode for general rectification.

Documents

Technical documentation and resources

Technical Data Sheet EN

Datasheet

Two-Resistor Model for Thermal Simulation

Thermal Design

Certificate of not containing SVHC under REACH Regulation

Environmental Data

How to Use LTspice® Models: Tips for Improving Convergence

Schematic Design & Verification

Basics of Thermal Resistance and Heat Dissipation

Thermal Design

About Export Regulations

Export Information

Notes for Calculating Power Consumption:Static Operation

Thermal Design

Moisture Sensitivity Level - Diodes

Package Information

List of Diode Package Thermal Resistance

Thermal Design

Measurement Method and Usage of Thermal Resistance RthJC

Thermal Design

Compliance of the RoHS directive

Environmental Data

About Flammability of Materials

Environmental Data

Notes for Temperature Measurement Using Forward Voltage of PN Junction

Thermal Design

Overview of ROHM's Simulation Models(for ICs and Discrete Semiconductors)

Technical Article

Taping Information

Package Information

What Is Thermal Design

Thermal Design

Importance of Probe Calibration When Measuring Power: Deskew

Schematic Design & Verification

PCB Layout Thermal Design Guide

Thermal Design

Notes for Temperature Measurement Using Thermocouples

Thermal Design

Inner Structure

Package Information

Condition of Soldering / Land Pattern Reference

Package Information

Package Dimensions

Package Information

Absolute Maximum Rating and Electrical Characteristics of Diodes

Technical Article

What is a Thermal Model? (Diode)

Thermal Design

How to Select Reverse Current Protection Diodes for LDO Regulators

Schematic Design & Verification

Impedance Characteristics of Bypass Capacitor

Schematic Design & Verification

Method for Monitoring Switching Waveform

Schematic Design & Verification

Diode Types and Applications

Technical Article

Part Explanation

Application Note

Anti-Whisker formation - Diodes

Package Information

Explanation for Marking

Package Information

Precautions When Measuring the Rear of the Package with a Thermocouple

Thermal Design

Method for Calculating Junction Temperature from Transient Thermal Resistance Data

Thermal Design

Reliability Test Result

Manufacturing Data

Power Loss and Thermal Design of Diodes

Thermal Design

How to Use LTspice® Models

Schematic Design & Verification