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R6006KND3TL1
Discrete Semiconductor Products

R6006KND3TL1

NRND
Rohm Semiconductor

600V 6A TO-252, HIGH-SPEED SWITCHING POWER MOSFET

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R6006KND3TL1
Discrete Semiconductor Products

R6006KND3TL1

NRND
Rohm Semiconductor

600V 6A TO-252, HIGH-SPEED SWITCHING POWER MOSFET

Technical Specifications

Parameters and characteristics for this part

SpecificationR6006KND3TL1
Current - Continuous Drain (Id) @ 25°C6 A
Drain to Source Voltage (Vdss)600 V
Drive Voltage (Max Rds On, Min Rds On)10 V
FET TypeN-Channel
Gate Charge (Qg) (Max) @ Vgs [Max]12 nC
Input Capacitance (Ciss) (Max) @ Vds350 pF
Mounting TypeSurface Mount
Operating Temperature150 °C
Package / CaseTO-252-3, SC-63, DPAK (2 Leads + Tab)
Power Dissipation (Max) [Max]70 W
Rds On (Max) @ Id, Vgs830 mOhm
Supplier Device PackageTO-252
TechnologyMOSFET (Metal Oxide)
Vgs (Max)20 V
Vgs(th) (Max) @ Id5.5 V

Pricing

Prices provided here are for design reference only. For realtime values and availability, please visit the distributors directly

DistributorPackageQuantity$
DigikeyN/A 2621$ 2.90
NewarkEach (Supplied on Cut Tape) 1$ 0.97

Description

General part information

R6006KND3 Series

R6006KND3 is a power MOSFET with low on-resistance and fast switching, suitable for the switching application.

Documents

Technical documentation and resources

R6006KND3TL1 | Datasheet

Datasheet

Technical Data Sheet EN

Datasheet

Package Dimensions

Package Information

Notes for Temperature Measurement Using Thermocouples

Thermal Design

Notes for Temperature Measurement Using Forward Voltage of PN Junction

Thermal Design

Two-Resistor Model for Thermal Simulation

Thermal Design

Method for Calculating Junction Temperature from Transient Thermal Resistance Data

Thermal Design

Precautions When Measuring the Rear of the Package with a Thermocouple

Thermal Design

Temperature derating method for Safe Operating Area (SOA)

Schematic Design & Verification

Reliability Test Result

Manufacturing Data

Method for Monitoring Switching Waveform

Schematic Design & Verification

About Export Regulations

Export Information

R6006KND3 ESD Data

Characteristics Data

How to Use the Thermal Resistance and Thermal Characteristics Parameters

Thermal Design

Basics of Thermal Resistance and Heat Dissipation

Thermal Design

Example of Heat Dissipation Design for TO Packages: Effect of Heat Dissipation Materials

Thermal Design

Part Explanation

Application Note

List of Transistor Package Thermal Resistance

Thermal Design

Types and Features of Transistors

Application Note

θ<sub>JC</sub> and Ψ<sub>JT</sub>

Thermal Design

Judgment Criteria of Thermal Evaluation

Thermal Design

About Flammability of Materials

Environmental Data

Measurement Method and Usage of Thermal Resistance RthJC

Thermal Design

Condition of Soldering / Land Pattern Reference

Package Information

Overview of ROHM's Simulation Models(for ICs and Discrete Semiconductors)

Technical Article

What is a Thermal Model? (Transistor)

Thermal Design

PCB Layout Thermal Design Guide

Thermal Design

Compliance of the RoHS directive

Environmental Data

Report of SVHC under REACH Regulation

Environmental Data

Moisture Sensitivity Level - Transistors

Package Information

How to Create Symbols for PSpice Models

Models

Impedance Characteristics of Bypass Capacitor

Schematic Design & Verification

Calculation of Power Dissipation in Switching Circuit

Schematic Design & Verification

How to Use LTspice&reg; Models

Schematic Design & Verification

Anti-Whisker formation - Transistors

Package Information

How to Use LTspice&reg; Models: Tips for Improving Convergence

Schematic Design & Verification

MOSFET Gate Drive Current Setting for Motor Driving

Technical Article

Importance of Probe Calibration When Measuring Power: Deskew

Schematic Design & Verification

Power Eco Family: Overview of ROHM's Power Semiconductor Lineup

White Paper

θ<sub>JA</sub> and Ψ<sub>JT</sub>

Thermal Design

What Is Thermal Design

Thermal Design

Notes for Calculating Power Consumption:Static Operation

Thermal Design

MOSFET Gate Resistor Setting for Motor Driving

Technical Article

TO-252_TL1 Taping Information

Package Information