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8-HTSOP-J
Integrated Circuits (ICs)

BD7F100EFJ-LBE2

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Rohm Semiconductor

OPTOCOUPLER-LESS ISOLATED FLYBACK CONVERTER

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8-HTSOP-J
Integrated Circuits (ICs)

BD7F100EFJ-LBE2

Active
Rohm Semiconductor

OPTOCOUPLER-LESS ISOLATED FLYBACK CONVERTER

Technical Specifications

Parameters and characteristics for this part

SpecificationBD7F100EFJ-LBE2
Current - Output1 A
Frequency - Switching400 kHz
FunctionStep-Up/Step-Down
Mounting TypeSurface Mount
Number of Outputs1
Operating Temperature [Max]125 °C
Operating Temperature [Min]-40 C
Output ConfigurationIsolation Capable, Positive
Output TypeAdjustable
Package / CaseExposed Pad, 8-SOIC
Package / Case [x]0.154 in
Package / Case [y]3.9 mm
Supplier Device Package8-HTSOP-J
Synchronous RectifierFalse
TopologyFlyback
Voltage - Input (Min) [Min]3 V
Voltage - Output (Max) [Max]50 V
Voltage - Output (Min/Fixed) [Min]0.78 V

Pricing

Prices provided here are for design reference only. For realtime values and availability, please visit the distributors directly

DistributorPackageQuantity$
DigikeyCut Tape (CT) 1$ 3.72
10$ 2.63
100$ 2.15
500$ 1.82
1000$ 1.67
Digi-Reel® 1$ 3.72
10$ 2.63
100$ 2.15
500$ 1.82
1000$ 1.67
N/A 7658$ 3.82
Tape & Reel (TR) 2500$ 1.60
5000$ 1.57
NewarkEach 1$ 3.89
10$ 2.61
25$ 2.43
50$ 2.32
100$ 2.18
250$ 2.08
500$ 2.04

Description

General part information

BD7F100 Series

This product guarantees long time supply availability in the industrial instrumentation market. BD7F100HFN-LB is an optocoupler-less Isolated Flyback Converter. An optocoupler or the tertiary winding feedback circuit which was needed to obtain a stable output voltage isolated by a transformer in the conventional application becomes unnecessary, thus, the number of parts is reduced drastically, producing a small-sized and high-reliability application isolated type power supply. Furthermore, a highly by the use of the Original Adapted-Type ON-Time Control Technology, it makes the external phase compensation parts become unnecessary, therefore a highly efficient isolated type power supply application can easily be produced.

Documents

Technical documentation and resources

HTSOP-J8 Taping Spec

Datasheet

BD7F100EFJ-LBE2 Flammability

Related Document

Five Steps for Successful Thermal Design of IC

White Paper

How to Use the Thermal Resistance and Thermal Characteristics Parameters

Thermal Design

Evaluation Board User's Guide for BD7F100EFJ-EVK-001 user's guide

User's Guide

Judgment Criteria of Thermal Evaluation

Thermal Design

PCB Layout Thermal Design Guide

Thermal Design

θ<sub>JA</sub> and Ψ<sub>JT</sub>

Thermal Design

Evaluation Board User's Guide for BD7F100EFJ-EVK-002 user's guide

User's Guide

Evaluation Board User's Guide for BD7F100EFJ-EVK-003 user's guide

User's Guide

Heat Dissipation Effect of Thermal Via in Exposed Pad Type Package

Thermal Design

Solder Joint Rate and Thermal Resistance of Exposed Pad

Thermal Design

Method for Calculating Junction Temperature from Transient Thermal Resistance Data

Thermal Design

Thermal Resistance

Thermal Design

What Is Thermal Design

Thermal Design

Overview of ROHM's Simulation Models(for ICs and Discrete Semiconductors)

Technical Article

BD7Fx00xxx-LB Series Reference Circuit

Reference Design

How to Use the Two-Resistor Model

Thermal Design

Design Guide and Example of Stencil for Exposed Pad

Thermal Design

Basics of Thermal Resistance and Heat Dissipation

Thermal Design

Impedance Characteristics of Bypass Capacitor

Schematic Design & Verification

θ<sub>JC</sub> and Ψ<sub>JT</sub>

Thermal Design

Compliance with the ELV directive

Environmental Data

Factory Information

Manufacturing Data

BD7F100EFJ-LB Data Sheet

Data Sheet

Anti-Whisker formation

Package Information

Technical Data Sheet EN

Datasheet

Product Change Notice EN

Datasheet