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RS1E200GNTB
Discrete Semiconductor Products

RS1E200GNTB

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Rohm Semiconductor

MOSFET N-CH 30V 20A 8HSOP

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RS1E200GNTB
Discrete Semiconductor Products

RS1E200GNTB

Active
Rohm Semiconductor

MOSFET N-CH 30V 20A 8HSOP

Technical Specifications

Parameters and characteristics for this part

SpecificationRS1E200GNTB
Current - Continuous Drain (Id) @ 25°C57 A, 20 A
Drain to Source Voltage (Vdss)30 V
Drive Voltage (Max Rds On, Min Rds On)10 V, 4.5 V
FET TypeN-Channel
Gate Charge (Qg) (Max) @ Vgs [Max]16.8 nC
Mounting TypeSurface Mount
Operating Temperature150 °C
Package / Case8-PowerTDFN
Power Dissipation (Max)25 W, 3 W
Rds On (Max) @ Id, Vgs4.6 mOhm
Supplier Device Package8-HSOP
TechnologyMOSFET (Metal Oxide)
Vgs (Max)20 V
Vgs(th) (Max) @ Id2.5 V

Pricing

Prices provided here are for design reference only. For realtime values and availability, please visit the distributors directly

DistributorPackageQuantity$
DigikeyN/A 2283$ 1.24

Description

General part information

RS1E200GN Series

Power MOSFETs are made as low ON-resistance devices by the micro-processing technologies useful for wide range of applications. Broad lineup covering compact types, high-power types and complex types to meet various needs in the market.

Documents

Technical documentation and resources

Notes for Calculating Power Consumption:Static Operation

Thermal Design

MOSFET Gate Resistor Setting for Motor Driving

Technical Article

Moisture Sensitivity Level - Transistors

Package Information

Basics of Thermal Resistance and Heat Dissipation

Thermal Design

Method for Monitoring Switching Waveform

Schematic Design & Verification

Temperature derating method for Safe Operating Area (SOA)

Schematic Design & Verification

HSOP8 Au Inner Structure

Package Information

Compliance of the RoHS directive

Environmental Data

Explanation for Marking

Package Information

Impedance Characteristics of Bypass Capacitor

Schematic Design & Verification

What is a Thermal Model? (Transistor)

Thermal Design

Method for Calculating Junction Temperature from Transient Thermal Resistance Data

Thermal Design

Condition of Soldering / Land Pattern Reference

Package Information

What Is Thermal Design

Thermal Design

Precautions When Measuring the Rear of the Package with a Thermocouple

Thermal Design

Measurement Method and Usage of Thermal Resistance RthJC

Thermal Design

MOSFET Gate Drive Current Setting for Motor Driving

Technical Article

About Export Regulations

Export Information

ESD Data

Characteristics Data

How to Create Symbols for PSpice Models

Models

How to Use LTspice® Models

Schematic Design & Verification

Report of SVHC under REACH Regulation

Environmental Data

Anti-Whisker formation - Transistors

Package Information

Notes for Temperature Measurement Using Thermocouples

Thermal Design

Overview of ROHM's Simulation Models(for ICs and Discrete Semiconductors)

Technical Article

Two-Resistor Model for Thermal Simulation

Thermal Design

Package Dimensions

Package Information

RS1E200GN Data Sheet

Data Sheet

Taping Information

Package Information

List of Transistor Package Thermal Resistance

Thermal Design

Part Explanation

Application Note

Importance of Probe Calibration When Measuring Power: Deskew

Schematic Design & Verification

Calculation of Power Dissipation in Switching Circuit

Schematic Design & Verification

Types and Features of Transistors

Application Note

About Flammability of Materials

Environmental Data

PCB Layout Thermal Design Guide

Thermal Design

How to Use LTspice® Models: Tips for Improving Convergence

Schematic Design & Verification

Notes for Temperature Measurement Using Forward Voltage of PN Junction

Thermal Design