1825046-2

Obsolete

CONN IC DIP SOCKET 8POS TIN

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Connectors, Interconnects

Obsolete

CONN IC DIP SOCKET 8POS TIN

Technical Specifications

Parameters and characteristics for this part

Specification	1825046-2

Contact Material - Mating	Beryllium Copper
Contact Material - Post [custom]	Brass
Contact Resistance	10 mOhm
Features	Open Frame
Mounting Type	Surface Mount
Number of Positions or Pins (Grid)	8
Pitch - Mating	0.1 in
Pitch - Mating	2.54 mm
Pitch - Post	2.54 mm
Pitch - Post	0.1 in
Termination	Solder
Type	0.3 "
Type	7.62 mm
Type	DIP

Part	Contact Material - Mating	Termination	Type	Type	Type	Contact Resistance	Contact Material - Post [custom]	Pitch - Mating	Pitch - Mating	Number of Positions or Pins (Grid) [custom]	Number of Positions or Pins (Grid) [custom]	Features	Mounting Type	Contact Finish - Mating	Pitch - Post	Pitch - Post	Number of Positions or Pins (Grid)
TE Connectivity Raychem Cable Protection 3-1825046-0	Beryllium Copper	Solder	DIP	0.6 in	15.24 mm	10 mOhm	Brass	0.1 in	2.54 mm	2 x 16	32	Open Frame	Surface Mount	Gold	2.54 mm	0.1 in
TE Connectivity Raychem Cable Protection 1825046-2	Beryllium Copper	Solder	DIP	0.3 "	7.62 mm	10 mOhm	Brass	0.1 in	2.54 mm			Open Frame	Surface Mount		2.54 mm	0.1 in	8

Prices provided here are for design reference only. For realtime values and availability, please visit the distributors directly

Distributor	Package	Quantity	$

General part information

8 (2 x 4) Pos DIP, 0.3" (7.62mm) Row Spacing Socket Tin Surface Mount

Technical documentation and resources

No documents available