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AG087FGD3HRBTL
Discrete Semiconductor Products

AG087FGD3HRBTL

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Rohm Semiconductor

NCH 40V 40A, TO-252 (DPAK), POWER MOSFET FOR AUTOMOTIVE

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AG087FGD3HRBTL
Discrete Semiconductor Products

AG087FGD3HRBTL

Active
Rohm Semiconductor

NCH 40V 40A, TO-252 (DPAK), POWER MOSFET FOR AUTOMOTIVE

Technical Specifications

Parameters and characteristics for this part

SpecificationAG087FGD3HRBTL
Drain to Source Voltage (Vdss)40 V
Drive Voltage (Max Rds On, Min Rds On)10 V, 4.5 V
FET TypeN-Channel
Gate Charge (Qg) (Max) @ Vgs14.9 nC
GradeAutomotive
Input Capacitance (Ciss) (Max) @ Vds [Max]790 pF
Mounting TypeSurface Mount
Operating Temperature175 °C
Package / CaseTO-252-3, SC-63, DPAK (2 Leads + Tab)
Power Dissipation (Max)53 W
QualificationAEC-Q101
Rds On (Max) @ Id, Vgs7 mOhm
Supplier Device PackageTO-252
TechnologyMOSFET (Metal Oxide)
Vgs (Max)20 V
Vgs(th) (Max) @ Id2.5 V

Pricing

Prices provided here are for design reference only. For realtime values and availability, please visit the distributors directly

DistributorPackageQuantity$
DigikeyN/A 2500$ 1.94

Description

General part information

AG087FGD3HRB Series

AG087FGD3HRB is an automotive grade MOSFET that is AEC-Q101 qualified. Ideal for Automotive Systems

Documents

Technical documentation and resources

AG087FGD3HRBTL | Datasheet

Datasheet

θ<sub>JC</sub> and Ψ<sub>JT</sub>

Thermal Design

Precautions When Measuring the Rear of the Package with a Thermocouple

Thermal Design

Method for Calculating Junction Temperature from Transient Thermal Resistance Data

Thermal Design

TO-252_TL Taping Information

Package Information

How to Use LTspice&reg; Models: Tips for Improving Convergence

Schematic Design & Verification

Package Dimensions

Package Information

Report of SVHC under REACH Regulation

Environmental Data

MOSFET Gate Resistor Setting for Motor Driving

Technical Article

Judgment Criteria of Thermal Evaluation

Thermal Design

Notes for Temperature Measurement Using Thermocouples

Thermal Design

MOSFET Gate Drive Current Setting for Motor Driving

Technical Article

Calculation of Power Dissipation in Switching Circuit

Schematic Design & Verification

About Export Regulations

Export Information

What is a Thermal Model? (Transistor)

Thermal Design

Importance of Probe Calibration When Measuring Power: Deskew

Schematic Design & Verification

θ<sub>JA</sub> and Ψ<sub>JT</sub>

Thermal Design

Part Explanation

Application Note

Moisture Sensitivity Level - Transistors

Package Information

AG087FGD3HRB ESD Data

Characteristics Data

Overview of ROHM's Simulation Models(for ICs and Discrete Semiconductors)

Technical Article

Report of SVHC under REACH Regulation

Environmental Data

Temperature derating method for Safe Operating Area (SOA)

Schematic Design & Verification

Example of Heat Dissipation Design for TO Packages: Effect of Heat Dissipation Materials

Thermal Design

How to Use the Thermal Resistance and Thermal Characteristics Parameters

Thermal Design

List of Transistor Package Thermal Resistance

Thermal Design

Anti-Whisker formation - Transistors

Package Information

Explanation for Marking

Package Information

Method for Monitoring Switching Waveform

Schematic Design & Verification

Types and Features of Transistors

Application Note

PCB Layout Thermal Design Guide

Thermal Design

Notes for Temperature Measurement Using Forward Voltage of PN Junction

Thermal Design

Two-Resistor Model for Thermal Simulation

Thermal Design

Basics of Thermal Resistance and Heat Dissipation

Thermal Design

Notes for Calculating Power Consumption:Static Operation

Thermal Design

How to Use LTspice&reg; Models

Schematic Design & Verification

Impedance Characteristics of Bypass Capacitor

Schematic Design & Verification

Compliance of the RoHS directive

Environmental Data

Condition of Soldering / Land Pattern Reference

Package Information

What Is Thermal Design

Thermal Design

Measurement Method and Usage of Thermal Resistance RthJC

Thermal Design

About Flammability of Materials

Environmental Data