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RBR40NS30ATL
Discrete Semiconductor Products

RBR40NS30ATL

Active
Rohm Semiconductor

LOW VF, 30V, 40A, TO-263S (D2PAK), SCHOTTKY BARRIER DIODE

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RBR40NS30ATL
Discrete Semiconductor Products

RBR40NS30ATL

Active
Rohm Semiconductor

LOW VF, 30V, 40A, TO-263S (D2PAK), SCHOTTKY BARRIER DIODE

Technical Specifications

Parameters and characteristics for this part

SpecificationRBR40NS30ATL
Current - Average Rectified (Io) (per Diode)20 A
Current - Reverse Leakage @ Vr600 µA
Diode Configuration1 Pair Common Cathode
Mounting TypeSurface Mount
Operating Temperature - Junction150 ¯C
Package / CaseD2PAK (2 Leads + Tab), TO-263-3, TO-263AB
Speed500 ns, 200 mA
Supplier Device PackageLPTS
TechnologySchottky
Voltage - DC Reverse (Vr) (Max) [Max]30 V
Voltage - Forward (Vf) (Max) @ If520 mV

Pricing

Prices provided here are for design reference only. For realtime values and availability, please visit the distributors directly

DistributorPackageQuantity$
DigikeyN/A 334$ 3.60

Description

General part information

RBR40NS30A Series

RBR40NS30A is low VFschottky Barrier Diode, suitable for switching power supply.

Documents

Technical documentation and resources

Absolute Maximum Rating and Electrical Characteristics of Diodes

Technical Article

Measurement Method and Usage of Thermal Resistance RthJC

Thermal Design

How to Create Symbols for PSpice Models

Models

Notes for Calculating Power Consumption:Static Operation

Thermal Design

How to Use LTspice® Models

Schematic Design & Verification

How to Use LTspice® Models: Tips for Improving Convergence

Schematic Design & Verification

Part Explanation

Application Note

RBR40NS30A ESD Data

Characteristics Data

ROHM's SBD Lineup Contributes to Greater Miniaturization and Lower Loss in Automotive, Industrial, and Consumer Equipment

White Paper

Method for Calculating Junction Temperature from Transient Thermal Resistance Data

Thermal Design

Power Loss and Thermal Design of Diodes

Thermal Design

Notes for Temperature Measurement Using Thermocouples

Thermal Design

Anti-Whisker formation - Diodes

Package Information

About Export Regulations

Export Information

Diode Selection Method for Asynchronous Converter

Schematic Design & Verification

Importance of Probe Calibration When Measuring Power: Deskew

Schematic Design & Verification

Basics of Thermal Resistance and Heat Dissipation

Thermal Design

Report of SVHC under REACH Regulation

Environmental Data

Diode Types and Applications

Technical Article

How to Select Rectifier Diodes

Technical Article

Inner Structure

Package Information

Impedance Characteristics of Bypass Capacitor

Schematic Design & Verification

θ<sub>JA</sub> and Ψ<sub>JT</sub>

Thermal Design

How to Select Reverse Current Protection Diodes for LDO Regulators

Schematic Design & Verification

Method for Monitoring Switching Waveform

Schematic Design & Verification

RBR40NS30A Data Sheet

Data Sheet

θ<sub>JC</sub> and Ψ<sub>JT</sub>

Thermal Design

What Is Thermal Design

Thermal Design

Reliability Test Result

Manufacturing Data

PCB Layout Thermal Design Guide

Thermal Design

Precautions When Measuring the Rear of the Package with a Thermocouple

Thermal Design

Overview of ROHM's Simulation Models(for ICs and Discrete Semiconductors)

Technical Article

What is a Thermal Model? (Diode)

Thermal Design

List of Diode Package Thermal Resistance

Thermal Design

Compliance of the RoHS directive

Environmental Data

Notes for Temperature Measurement Using Forward Voltage of PN Junction

Thermal Design

How to Use the Thermal Resistance and Thermal Characteristics Parameters

Thermal Design

Judgment Criteria of Thermal Evaluation

Thermal Design

Two-Resistor Model for Thermal Simulation

Thermal Design