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R6530ENXC7G
Discrete Semiconductor Products

R6530ENXC7G

Active
Rohm Semiconductor

MOSFET SINGLE, 30A, 650V, 86W ROHS COMPLIANT: YES

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R6530ENXC7G
Discrete Semiconductor Products

R6530ENXC7G

Active
Rohm Semiconductor

MOSFET SINGLE, 30A, 650V, 86W ROHS COMPLIANT: YES

Technical Specifications

Parameters and characteristics for this part

SpecificationR6530ENXC7G
Current - Continuous Drain (Id) @ 25°C30 A
Drain to Source Voltage (Vdss)650 V
Drive Voltage (Max Rds On, Min Rds On)10 V
FET TypeN-Channel
Gate Charge (Qg) (Max) @ Vgs90 nC
Input Capacitance (Ciss) (Max) @ Vds2100 pF
Mounting TypeThrough Hole
Operating Temperature150 °C
Package / CaseTO-220-3 Full Pack
Power Dissipation (Max)86 W
Rds On (Max) @ Id, Vgs140 mOhm
Supplier Device PackageTO-220FM
TechnologyMOSFET (Metal Oxide)
Vgs (Max)20 V
Vgs(th) (Max) @ Id4 V

Pricing

Prices provided here are for design reference only. For realtime values and availability, please visit the distributors directly

DistributorPackageQuantity$
DigikeyN/A 713$ 3.89
NewarkEach 1$ 3.90
10$ 3.89
25$ 3.04

Description

General part information

R6530ENX Series

R6530ENX is a power MOSFET with low-on resistance and fast switching speed, suitable for switching.

Documents

Technical documentation and resources

Technical Data Sheet EN

Datasheet

Temperature derating method for Safe Operating Area (SOA)

Schematic Design & Verification

MOSFET Gate Drive Current Setting for Motor Driving

Technical Article

Two-Resistor Model for Thermal Simulation

Thermal Design

Notes for Temperature Measurement Using Thermocouples

Thermal Design

Part Explanation

Application Note

Moisture Sensitivity Level - Transistors

Package Information

Measurement Method and Usage of Thermal Resistance RthJC

Thermal Design

Explanation for Marking

Package Information

Method for Calculating Junction Temperature from Transient Thermal Resistance Data

Thermal Design

MOSFET Gate Resistor Setting for Motor Driving

Technical Article

Calculation of Power Dissipation in Switching Circuit

Schematic Design & Verification

About Export Regulations

Export Information

How to Use the Thermal Resistance and Thermal Characteristics Parameters

Thermal Design

Judgment Criteria of Thermal Evaluation

Thermal Design

Overview of ROHM's Simulation Models(for ICs and Discrete Semiconductors)

Technical Article

How to Use LTspice® Models

Schematic Design & Verification

Types and Features of Transistors

Application Note

Notes for Temperature Measurement Using Forward Voltage of PN Junction

Thermal Design

Precautions When Measuring the Rear of the Package with a Thermocouple

Thermal Design

Compliance of the RoHS directive

Environmental Data

Inner Structure

Package Information

θ<sub>JC</sub> and Ψ<sub>JT</sub>

Thermal Design

How to Use LTspice&reg; Models: Tips for Improving Convergence

Schematic Design & Verification

Importance of Probe Calibration When Measuring Power: Deskew

Schematic Design & Verification

List of Transistor Package Thermal Resistance

Thermal Design

What is a Thermal Model? (Transistor)

Thermal Design

Power Eco Family: Overview of ROHM's Power Semiconductor Lineup

White Paper

Reliability Test Result

Manufacturing Data

PCB Layout Thermal Design Guide

Thermal Design

Package Dimensions

Package Information

Basics of Thermal Resistance and Heat Dissipation

Thermal Design

How to Create Symbols for PSpice Models

Models

About Flammability of Materials

Environmental Data

Impedance Characteristics of Bypass Capacitor

Schematic Design & Verification

Notes for Calculating Power Consumption:Static Operation

Thermal Design

θ<sub>JA</sub> and Ψ<sub>JT</sub>

Thermal Design

Anti-Whisker formation - Transistors

Package Information

Example of Heat Dissipation Design for TO Packages: Effect of Heat Dissipation Materials

Thermal Design

Method for Monitoring Switching Waveform

Schematic Design & Verification

What Is Thermal Design

Thermal Design

R6530ENX ESD Data

Characteristics Data