Integrated Circuits (ICs)

R7F701372AEABG-C#BC1

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IC MCU 32BIT 4MB FLASH 292FBGA

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Integrated Circuits (ICs)

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IC MCU 32BIT 4MB FLASH 292FBGA

Technical Specifications

Parameters and characteristics for this part

Specification	R7F701372AEABG-C#BC1

Connectivity	LINbus, FlexRay, SENT, SPI, UART/USART, CSI, FIFO, CANbus
Core Processor	RH850G3M
Core Size	32-Bit Quad-Core
Data Converters	A/D 32x12b
EEPROM Size	128 K
Mounting Type	Surface Mount
Operating Temperature [Max]	150 °C
Operating Temperature [Min]	-40 °C
Oscillator Type	Internal
Package / Case	292-FBGA
Peripherals	DMA, POR, PWM, WDT, Temp Sensor
Program Memory Size	4 MB
Program Memory Type	FLASH
RAM Size	1.0625 M
Speed	240 MHz
Supplier Device Package	292-FBGA
Supplier Device Package [x]	17
Supplier Device Package [y]	17

Part	Mounting Type	EEPROM Size	Supplier Device Package [y]	Supplier Device Package	Supplier Device Package [x]	Core Processor	Program Memory Type	Speed	Peripherals	Oscillator Type	Program Memory Size	Operating Temperature [Min]	Operating Temperature [Max]	Package / Case	Data Converters	Core Size	Connectivity	RAM Size
Renesas Electronics Corporation R7F701372AEABG-C#BC1	Surface Mount	128 K	17	292-FBGA	17	RH850G3M	FLASH	240 MHz	DMA POR PWM Temp Sensor WDT	Internal	4 MB	-40 °C	150 °C	292-FBGA	A/D 32x12b	32-Bit Quad-Core	CANbus CSI FIFO FlexRay LINbus SENT SPI UART/USART	1.0625 M

Prices provided here are for design reference only. For realtime values and availability, please visit the distributors directly

General part information

RH850G3M RH850/P1H-C Microcontroller IC 32-Bit Quad-Core 240MHz 4MB (4M x 8) FLASH 292-FBGA (17x17)

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