Specification	74AHCU04PW-Q100J

Current - Output High, Low [custom]	8 mA
Current - Output High, Low [custom]	8 mA
Grade	Automotive
Input Logic Level - High [Max]	4.4 V
Input Logic Level - High [Min]	1.7 V
Input Logic Level - Low [Max]	1.1 V
Input Logic Level - Low [Min]	0.3 V
Logic Type	Inverter
Max Propagation Delay @ V, Max CL	7 ns
Mounting Type	Surface Mount
Number of Circuits	6
Number of Inputs [custom]	1
Operating Temperature [Max]	125 °C
Operating Temperature [Min]	-40 C
Package / Case	14-TSSOP
Package / Case [x]	0.173 ", 4.4 mm
Qualification	AEC-Q100
Supplier Device Package	14-TSSOP
Voltage - Supply [Max]	5.5 V
Voltage - Supply [Min]	2 V

74AHCU04PW-Q100 Series

Hex unbuffered inverter

Part	Qualification	Voltage - Supply [Max]	Voltage - Supply [Min]	Package / Case [x]	Package / Case	Input Logic Level - Low [Max]	Input Logic Level - Low [Min]	Max Propagation Delay @ V, Max CL	Supplier Device Package	Number of Inputs [custom]	Input Logic Level - High [Max]	Input Logic Level - High [Min]	Number of Circuits	Current - Output High, Low [custom]	Current - Output High, Low [custom]	Logic Type	Operating Temperature [Max]	Operating Temperature [Min]	Grade	Mounting Type
Nexperia USA Inc. 74AHCU04PW-Q100J	AEC-Q100	5.5 V	2 V	0.173 " 4.4 mm	14-TSSOP	1.1 V	0.3 V	7 ns	14-TSSOP	1	4.4 V	1.7 V	6	8 mA	8 mA	Inverter	125 °C	-40 C	Automotive	Surface Mount

Pricing

Prices provided here are for design reference only. For realtime values and availability, please visit the distributors directly

Distributor	Package	Quantity	$

Digikey	N/A	0	$ 0.41
		3108	$ 0.41

Description

General part information

74AHCU04PW-Q100 Series

The 74AHCU04-Q100 is high-speed Si-gate CMOS device and is pin compatible with low-power Schottky TTL (LSTTL). It is specified in compliance with JEDEC standard No. 7A.

Documents

Technical documentation and resources

74AHCU04PW-Q100J | Datasheet

Datasheet

74AHCU04PW-Q100 Nexperia Product Reliability

Quality document

plastic, thin shrink small outline package; 14 leads; 0.65 mm pitch; 5 mm x 4.4 mm x 1.1 mm body

Marcom graphics

Footprint for wave soldering

Wave soldering

plastic, thin shrink small outline package; 14 leads; 0.65 mm pitch; 5 mm x 4.4 mm x 1.2 mm body

Package information

Nexperia package poster

Leaflet

TSSOP14; Reel pack for SMD, 13"; Q1/T1 product orientation

Packing information