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ADRF5132BCPZN
RF and Wireless

ADRF5132BCPZN

Active
Analog Devices Inc./Maxim Integrated

RF SWITCH, SILICON, SPDT, 700 MHZ TO 5 GHZ, 4.5 V TO 5.4 V SUPPLY, -40 TO 105 °C, LFCSP-EP-16

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ADRF5132BCPZN
RF and Wireless

ADRF5132BCPZN

Active
Analog Devices Inc./Maxim Integrated

RF SWITCH, SILICON, SPDT, 700 MHZ TO 5 GHZ, 4.5 V TO 5.4 V SUPPLY, -40 TO 105 °C, LFCSP-EP-16

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Technical Specifications

Parameters and characteristics for this part

SpecificationADRF5132BCPZN
CircuitSPDT
Frequency Range (Max)5 GHz
Frequency Range (Min)700 MHz
IIP362 dBm
Impedance50 Ohm
Insertion Loss0.9 dB
Isolation35 dB
Mounting TypeSurface Mount
Operating Temperature (Max)105 °C
Operating Temperature (Min)-40 °C
Package / Case16-WFQFN Exposed Pad, CSP
Package Length3 mm
Package Name16-LFCSP-WQ
Package Width3 mm
RF TypeGeneral Purpose
Test Frequency5 GHz
TopologyReflective
Voltage - Supply (Maximum)5.4 V
Voltage - Supply (Minimum)4.5 V

Pricing

Prices provided here are for design reference only. For realtime values and availability, please visit the distributors directly

DistributorPackageQuantity$Updated
DigikeyBulk 1$ 41.51<1d
10$ 36.33
25$ 34.53
100$ 32.07
250$ 30.60
NewarkEach 1$ 42.051m+
5$ 38.19
10$ 34.33
25$ 30.62
50$ 29.53
100$ 28.44
250$ 26.91

CAD

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Description

General part information

ADRF5132 Series

The ADRF5132 is a high power, reflective, 0.7 GHz to 5.0 GHz, silicon, single-pole, double-throw (SPDT) reflective switch in a leadless, surface-mount package. The switch is ideal for high power and cellular infrastructure applications, like long-term evolution (LTE) base stations. The ADRF5132 has high power handling of 35 dBm LTE (average typical at 105°C), a low insertion loss of 0.6 dB at 2.7 GHz, input third-order intercept of 65 dBm (typical), and 0.1 dB compression (P0.1dB) of 42.5 dBm.The on-chip circuitry operates at a single, positive supply voltage of 5 V and a typical supply current of 1.1 mA typical, making the ADRF5132 an ideal alternative to pin diode-based switches.The device is in a RoHS compliant, compact, 16-lead, 3 mm × 3 mm LFCSP package.ApplicationsCellular/4G infrastructureWireless infrastructureMilitary and high reliability applicationsTest equipmentPin diode replacement

Documents

Technical documentation and resources