Deep-Dive with AI
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Deep-Dive with AI
Technical Specifications
Parameters and characteristics for this part
| Specification | PA0026C |
|---|---|
| Board Thickness | 0.063 in |
| Board Thickness | 1.6 mm |
| Material | FR4 Epoxy Glass |
| Number of Positions | 8 |
| Package Accepted | uMAX, MSOP, uSOP |
| Pitch | 0.65 mm |
| Pitch | 0.026 in |
| Proto Board Type | SMD to DIP |
| Size / Dimension [x] | 0.4 " |
| Size / Dimension [x] | 10.16 mm |
| Size / Dimension [y] | 10.16 mm |
| Size / Dimension [y] | 0.4 " |
Pricing
Prices provided here are for design reference only. For realtime values and availability, please visit the distributors directly
| Distributor | Package | Quantity | $ | |
|---|---|---|---|---|
| Digikey | Bulk | 1 | $ 6.49 | |
| N/A | 81 | $ 6.49 | ||
Description
General part information
PA0026 Series
UMAX-8/USOP-8/MSOP-8 TO DIP-8 SM
Documents
Technical documentation and resources
No documents available