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UMZ1NTR
Discrete Semiconductor Products

UMZ1NTR

Active
Rohm Semiconductor

BIPOLAR TRANSISTOR ARRAY, DUAL, NPN, PNP, 50 V, 50 V, 150 MA, 150 MA, 150 MW

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UMZ1NTR
Discrete Semiconductor Products

UMZ1NTR

Active
Rohm Semiconductor

BIPOLAR TRANSISTOR ARRAY, DUAL, NPN, PNP, 50 V, 50 V, 150 MA, 150 MA, 150 MW

Technical Specifications

Parameters and characteristics for this part

SpecificationUMZ1NTR
Current - Collector (Ic) (Max) [Max]150 mA
Current - Collector Cutoff (Max) [Max]100 nA
DC Current Gain (hFE) (Min) @ Ic, Vce [Min]120
Frequency - Transition180 MHz, 140 MHz
Mounting TypeSurface Mount
Operating Temperature150 °C
Package / CaseSOT-363, SC-88, 6-TSSOP
Supplier Device PackageUMT6
Transistor Type1 NPN, 1 PNP
Vce Saturation (Max) @ Ib, Ic500 mV, 400 mV
Voltage - Collector Emitter Breakdown (Max) [Max]50 V

Pricing

Prices provided here are for design reference only. For realtime values and availability, please visit the distributors directly

DistributorPackageQuantity$
DigikeyN/A 91756$ 0.37
NewarkEach (Supplied on Cut Tape) 1$ 0.39
10$ 0.24
25$ 0.21
50$ 0.18
100$ 0.15
300$ 0.13
500$ 0.11
1000$ 0.10

Description

General part information

UMZ1N Series

Devices integrating two transistors are available in ultra-compact packages, suitable for various applications such as pre-amplifier differential amplification circuits, high-frequency oscillators, driver ICs and so forth.

Documents

Technical documentation and resources

How to Use LTspice® Models

Schematic Design & Verification

Two-Resistor Model for Thermal Simulation

Thermal Design

What is a Thermal Model? (Transistor)

Thermal Design

Inner Structure

Package Information

Condition of Soldering / Land Pattern Reference

Package Information

Reliability Test Result

Manufacturing Data

UMZ1N Data Sheet

Data Sheet

How to Create Symbols for PSpice Models

Models

Taping Information

Package Information

Overview of ROHM's Simulation Models(for ICs and Discrete Semiconductors)

Technical Article

Method for Monitoring Switching Waveform

Schematic Design & Verification

What Is Thermal Design

Thermal Design

Compliance of the RoHS directive

Environmental Data

Part Explanation

Application Note

Precautions When Measuring the Rear of the Package with a Thermocouple

Thermal Design

Explanation for Marking

Package Information

Moisture Sensitivity Level - Transistors

Package Information

Method for Calculating Junction Temperature from Transient Thermal Resistance Data

Thermal Design

How to Use LTspice® Models: Tips for Improving Convergence

Schematic Design & Verification

Impedance Characteristics of Bypass Capacitor

Schematic Design & Verification

Basics of Thermal Resistance and Heat Dissipation

Thermal Design

List of Transistor Package Thermal Resistance

Thermal Design

Anti-Whisker formation - Transistors

Package Information

Notes for Temperature Measurement Using Thermocouples

Thermal Design

Certificate of not containing SVHC under REACH Regulation

Environmental Data

Notes for Calculating Power Consumption:Static Operation

Thermal Design

Package Dimensions

Package Information

PCB Layout Thermal Design Guide

Thermal Design

Types and Features of Transistors

Application Note

Importance of Probe Calibration When Measuring Power: Deskew

Schematic Design & Verification

Measurement Method and Usage of Thermal Resistance RthJC

Thermal Design

About Flammability of Materials

Environmental Data

Notes for Temperature Measurement Using Forward Voltage of PN Junction

Thermal Design

Temperature derating method for Safe Operating Area (SOA)

Schematic Design & Verification

About Export Regulations

Export Information

ESD Data

Characteristics Data

Calculation of Power Dissipation in Switching Circuit

Schematic Design & Verification