Integrated Circuits (ICs)

74HC367DB,112

Active

IC BUFF DVR TRI-ST HEX 16SSOP

Search across all available documentation for this part.

Integrated Circuits (ICs)

Active

IC BUFF DVR TRI-ST HEX 16SSOP

Technical Specifications

Parameters and characteristics for this part

Specification	74HC367DB,112

Current - Output High, Low [custom]	7.8 mA
Current - Output High, Low [custom]	7.8 mA
Logic Type	Buffer, Non-Inverting
Mounting Type	Surface Mount
Number of Bits per Element	4, 2
Number of Elements	2
Operating Temperature [Max]	125 °C
Operating Temperature [Min]	-40 °C
Output Type	3-State
Package / Case	16-SSOP
Package / Case [custom]	0.209 in
Package / Case [custom]	5.3 mm
Supplier Device Package	16-SSOP
Voltage - Supply [Max]	6 V
Voltage - Supply [Min]	2 V

Part	Supplier Device Package	Operating Temperature [Min]	Operating Temperature [Max]	Package / Case	Package / Case	Package / Case	Number of Elements	Current - Output High, Low [custom]	Current - Output High, Low [custom]	Mounting Type	Number of Bits per Element	Output Type	Logic Type	Voltage - Supply [Min]	Voltage - Supply [Max]	Package / Case [custom]	Package / Case [custom]
Freescale Semiconductor - NXP 74HC367N,652	16-DIP	-40 °C	125 °C	0.3 in	16-DIP	7.62 mm	2	7.8 mA	7.8 mA	Through Hole	2 4	3-State	Buffer Non-Inverting	2 V	6 V
Freescale Semiconductor - NXP 74HC367DB,112	16-SSOP	-40 °C	125 °C		16-SSOP		2	7.8 mA	7.8 mA	Surface Mount	2 4	3-State	Buffer Non-Inverting	2 V	6 V	0.209 in	5.3 mm

Prices provided here are for design reference only. For realtime values and availability, please visit the distributors directly

Distributor	Package	Quantity	$

Digikey	Tube	833	$ 0.36

General part information

Buffer, Non-Inverting 2 Element 2, 4 (Hex) Bit per Element 3-State Output 16-SSOP

Technical documentation and resources

No documents available