Specification	BD67173NUX-E2

Applications	PDA's, PC's
Current - Output	6.6 mA
Function	Driver
Interface	Logic
Motor Type - AC, DC	Brushless DC (BLDC)
Mounting Type	Surface Mount
Operating Temperature [Max]	95 °C
Operating Temperature [Min]	-25 °C
Output Configuration	Pre-Driver - Half Bridge (3)
Package / Case	10-UFDFN Exposed Pad
Supplier Device Package	VSON010X3030
Technology	Power MOSFET
Voltage - Supply [Max]	5.5 V
Voltage - Supply [Min]	2.2 V

BD67173NUX Series

Three-phase Full-Wave Fan Motor Driver

Part	Current - Output	Motor Type - AC, DC	Mounting Type	Interface	Package / Case	Function	Technology	Voltage - Supply [Min]	Voltage - Supply [Max]	Supplier Device Package	Applications	Operating Temperature [Max]	Operating Temperature [Min]	Output Configuration
Rohm Semiconductor BD67173NUX-E2	6.6 mA	Brushless DC (BLDC)	Surface Mount	Logic	10-UFDFN Exposed Pad	Driver	Power MOSFET	2.2 V	5.5 V	VSON010X3030	PC's PDA's	95 °C	-25 °C	Pre-Driver - Half Bridge (3)

Pricing

Prices provided here are for design reference only. For realtime values and availability, please visit the distributors directly

Distributor	Package	Quantity	$

Digikey	N/A	0	$ 1.10
Mouser	N/A	1	$ 1.86
		10	$ 1.19
		25	$ 1.06
		100	$ 0.87
		250	$ 0.76
		500	$ 0.72
		1000	$ 0.60
		4000	$ 0.55
		8000	$ 0.47
Newark	Each (Supplied on Cut Tape)	1	$ 1.85
		10	$ 1.00
		25	$ 0.91
		50	$ 0.82
		100	$ 0.73
		250	$ 0.70
		500	$ 0.66
		1000	$ 0.60

Description

General part information

BD67173NUX Series

BD67173NUX is a three-phase sensor less fan motor driver used to cool off notebook PCs. It is controlled by a variable speed provided through the PWM input signal. Its feature is sensor less drive which doesn’t require a hall device as a location detection sensor and motor downsizing can be achieved by limiting the number of external components as much as possible. Furthermore, introducing a direct PWM soft switched driving mechanism achieves silent operations and low vibrations.

Documents

Technical documentation and resources

Factory Information

Manufacturing Data

Method for Calculating Junction Temperature from Transient Thermal Resistance Data

Thermal Design

BD67173NUX-E2

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BD67173NUX-E2

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Technical Specifications

BD67173NUX Series

Pricing

Description

BD67173NUX Series

Documents

Factory Information

Method for Calculating Junction Temperature from Transient Thermal Resistance Data

What Is Thermal Design

Solder Joint Rate and Thermal Resistance of Exposed Pad

MOSFET Gate Drive Current Setting for Motor Driving

UL94 Flame Classifications of Mold Compound

MOSFET Gate Resistor Setting for Motor Driving

Heat Dissipation Effect of Thermal Via in Exposed Pad Type Package

PCB Layout Thermal Design Guide

Overview of ROHM's Simulation Models(for ICs and Discrete Semiconductors)

Basics of Thermal Resistance and Heat Dissipation

Precautions When Measuring the Rear of the Package with a Thermocouple

Compliance with the ELV directive

VSON010X3030 Package Information

Impedance Characteristics of Bypass Capacitor

BD67173NUX Data Sheet

θ<sub>JC</sub> and Ψ<sub>JT</sub>

Design Guide and Example of Stencil for Exposed Pad

How to Use the Thermal Resistance and Thermal Characteristics Parameters

Thermal Resistance

Anti-Whisker formation

Five Steps for Successful Thermal Design of IC

θ<sub>JA</sub> and Ψ<sub>JT</sub>

Two-Resistor Model for Thermal Simulation

Judgment Criteria of Thermal Evaluation

BD67173NUX Series