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Discrete Semiconductor Products

RGSX5TS65EGC11

NRND
Rohm Semiconductor

8ΜS SHORT-CIRCUIT TOLERANCE, 650V 75A, FRD BUILT-IN, FIELD STOP TRENCH IGBT

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Product dimension image
Discrete Semiconductor Products

RGSX5TS65EGC11

NRND
Rohm Semiconductor

8ΜS SHORT-CIRCUIT TOLERANCE, 650V 75A, FRD BUILT-IN, FIELD STOP TRENCH IGBT

Technical Specifications

Parameters and characteristics for this part

SpecificationRGSX5TS65EGC11
Current - Collector (Ic) (Max) [Max]114 A
Current - Collector Pulsed (Icm)225 A
Gate Charge79 nC
IGBT TypeTrench Field Stop
Mounting TypeThrough Hole
Operating Temperature [Max]175 °C
Operating Temperature [Min]-40 °C
Package / CaseTO-247-3
Power - Max [Max]404 W
Reverse Recovery Time (trr)116 ns
Supplier Device PackageTO-247N
Switching Energy1.9 mJ, 3.44 mJ
Td (on/off) @ 25°C [custom]113 ns
Td (on/off) @ 25°C [custom]43 ns
Test Condition10 Ohm, 400 V, 75 A, 15 V
Vce(on) (Max) @ Vge, Ic2.15 V
Voltage - Collector Emitter Breakdown (Max) [Max]650 V

Pricing

Prices provided here are for design reference only. For realtime values and availability, please visit the distributors directly

DistributorPackageQuantity$
DigikeyN/A 359$ 5.38
NewarkEach 1$ 5.55
10$ 5.54
25$ 4.85

Description

General part information

RGSX5TS65E Series

RGSX5TS65E is a 8μs SCSOA guaranteed IGBT, suitable for general inverter, UPS, Welder and power conditioner.

Documents

Technical documentation and resources

Generation Mechanism of Voltage Surge on Commutation Side (Basic)

Technical Article

Two-Resistor Model for Thermal Simulation

Thermal Design

θ<sub>JA</sub> and Ψ<sub>JT</sub>

Thermal Design

Compliance of the ELV directive

Environmental Data

How to Create Symbols for PSpice Models

Models

What Is Thermal Design

Thermal Design

Anti-Whisker formation

Package Information

θ<sub>JC</sub> and Ψ<sub>JT</sub>

Thermal Design

Precautions for Thermal Resistance of Insulation Sheet

Thermal Design

Notes for Calculating Power Consumption:Static Operation

Thermal Design

Method for Calculating Junction Temperature from Transient Thermal Resistance Data

Thermal Design

Notes for Temperature Measurement Using Thermocouples

Thermal Design

Notes for Temperature Measurement Using Forward Voltage of PN Junction

Thermal Design

Impedance Characteristics of Bypass Capacitor

Schematic Design & Verification

Package Dimensions

Package Information

About Export Administration Regulations (EAR)

Export Information

4 Steps for Successful Thermal Designing of Power Devices

White Paper

About Flammability of Materials

Environmental Data

Measurement Method and Usage of Thermal Resistance RthJC

Thermal Design

PCB Layout Thermal Design Guide

Thermal Design

Power Eco Family: Overview of ROHM's Power Semiconductor Lineup

White Paper

Part Explanation

Application Note

Calculation of Power Dissipation in Switching Circuit

Schematic Design & Verification

Judgment Criteria of Thermal Evaluation

Thermal Design

Overview of ROHM's Simulation Models(for ICs and Discrete Semiconductors)

Technical Article

Importance of Probe Calibration When Measuring Power: Deskew

Schematic Design & Verification

How to Use LTspice&reg; Models

Schematic Design & Verification

Moisture Sensitivity Level

Package Information

Semikron Danfoss: Partnering for the Safe Supply of Industrial Power Modules

White Paper

Basics of Thermal Resistance and Heat Dissipation

Thermal Design

What is a Thermal Model? (IGBT)

Thermal Design

The Problem with Traditional Vaccine Storage Freezers and How ROHM Cutting-edge Power Solutions Can Take them to the Next Level

White Paper

How to Use LTspice&reg; Models: Tips for Improving Convergence

Schematic Design & Verification

Precautions When Measuring the Rear of the Package with a Thermocouple

Thermal Design

RGSX5TS65E Data Sheet

Data Sheet

Estimation of switching losses in IGBTs operating with resistive load

Schematic Design & Verification

Method for Monitoring Switching Waveform

Schematic Design & Verification

How to Use the Thermal Resistance and Thermal Characteristics Parameters

Thermal Design

Example of Heat Dissipation Design for TO Packages: Effect of Heat Dissipation Materials

Thermal Design

Types and Features of Transistors

Application Note