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Discrete Semiconductor Products

R4P020N06HZGT100

Active
Rohm Semiconductor

MOSFET, N-CHANNEL, 60V, 2A, SOT-89 ROHS COMPLIANT: YES

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Product thumbnail image
Discrete Semiconductor Products

R4P020N06HZGT100

Active
Rohm Semiconductor

MOSFET, N-CHANNEL, 60V, 2A, SOT-89 ROHS COMPLIANT: YES

Technical Specifications

Parameters and characteristics for this part

SpecificationR4P020N06HZGT100
Current - Continuous Drain (Id) @ 25°C2 A
Drain to Source Voltage (Vdss)60 V
Drive Voltage (Max Rds On, Min Rds On) [Max]4 V
Drive Voltage (Max Rds On, Min Rds On) [Min]10 V
FET TypeN-Channel
Gate Charge (Qg) (Max) @ Vgs7 nC
GradeAutomotive
Input Capacitance (Ciss) (Max) @ Vds140 pF
Mounting TypeSurface Mount
Operating Temperature150 °C
Package / CaseTO-243AA
Power Dissipation (Max)500 mW
QualificationAEC-Q101
Rds On (Max) @ Id, Vgs200 mOhm
TechnologyMOSFET (Metal Oxide)
Vgs (Max)20 V
Vgs(th) (Max) @ Id2.5 V

Pricing

Prices provided here are for design reference only. For realtime values and availability, please visit the distributors directly

DistributorPackageQuantity$
DigikeyN/A 0$ 1.08
NewarkEach (Supplied on Cut Tape) 1$ 1.12
10$ 0.70
25$ 0.62
50$ 0.54
100$ 0.46
250$ 0.41
500$ 0.36

Description

General part information

R4P020N06HZG Series

R4P020N06HZG is an automotive grade MOSFET that is AEC-Q101 qualified. Ideal for Switching

Documents

Technical documentation and resources

Two-Resistor Model for Thermal Simulation

Thermal Design

Compliance of the RoHS directive

Environmental Data

MOSFET Gate Drive Current Setting for Motor Driving

Technical Article

R4P020N06HZG Data Sheet

Data Sheet

Taping Information

Package Information

How to Use LTspice® Models: Tips for Improving Convergence

Schematic Design & Verification

About Flammability of Materials

Environmental Data

What Is Thermal Design

Thermal Design

List of Transistor Package Thermal Resistance

Thermal Design

Method for Monitoring Switching Waveform

Schematic Design & Verification

Package Dimensions

Package Information

Moisture Sensitivity Level - Transistors

Package Information

Notes for Temperature Measurement Using Thermocouples

Thermal Design

About Export Regulations

Export Information

Notes for Calculating Power Consumption:Static Operation

Thermal Design

Method for Calculating Junction Temperature from Transient Thermal Resistance Data

Thermal Design

MOSFET Gate Resistor Setting for Motor Driving

Technical Article

Impedance Characteristics of Bypass Capacitor

Schematic Design & Verification

Importance of Probe Calibration When Measuring Power: Deskew

Schematic Design & Verification

Part Explanation

Application Note

Explanation for Marking

Package Information

PCB Layout Thermal Design Guide

Thermal Design

Precautions When Measuring the Rear of the Package with a Thermocouple

Thermal Design

θ<sub>JC</sub> and Ψ<sub>JT</sub>

Thermal Design

Basics of Thermal Resistance and Heat Dissipation

Thermal Design

Notes for Temperature Measurement Using Forward Voltage of PN Junction

Thermal Design

Calculation of Power Dissipation in Switching Circuit

Schematic Design & Verification

Condition of Soldering / Land Pattern Reference

Package Information

Measurement Method and Usage of Thermal Resistance RthJC

Thermal Design

Overview of ROHM's Simulation Models(for ICs and Discrete Semiconductors)

Technical Article

Types and Features of Transistors

Application Note

Temperature derating method for Safe Operating Area (SOA)

Schematic Design & Verification

How to Use the Thermal Resistance and Thermal Characteristics Parameters

Thermal Design

θ<sub>JA</sub> and Ψ<sub>JT</sub>

Thermal Design

Judgment Criteria of Thermal Evaluation

Thermal Design

Anti-Whisker formation - Transistors

Package Information

Report of SVHC under REACH Regulation

Environmental Data

How to Use LTspice&reg; Models

Schematic Design & Verification

What is a Thermal Model? (Transistor)

Thermal Design