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RR264MM-400TFTR
Discrete Semiconductor Products

RR264MM-400TFTR

Active
Rohm Semiconductor

STANDARD RECOVERY DIODE, 400 V, 700 MA, SINGLE, 1.1 V, 25 A

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RR264MM-400TFTR
Discrete Semiconductor Products

RR264MM-400TFTR

Active
Rohm Semiconductor

STANDARD RECOVERY DIODE, 400 V, 700 MA, SINGLE, 1.1 V, 25 A

Technical Specifications

Parameters and characteristics for this part

SpecificationRR264MM-400TFTR
Current - Average Rectified (Io)700 mA
Current - Reverse Leakage @ Vr10 µA
Mounting TypeSurface Mount
Operating Temperature - Junction [Max]150 °C
Package / CaseSOD-123F
Speed [Min]200 mA, 500 ns
Supplier Device PackagePMDU
TechnologyStandard
Voltage - DC Reverse (Vr) (Max) [Max]400 V
Voltage - Forward (Vf) (Max) @ If1.1 V

Pricing

Prices provided here are for design reference only. For realtime values and availability, please visit the distributors directly

DistributorPackageQuantity$
DigikeyN/A 1865$ 0.43

Description

General part information

RR264MM-400TF Series

This product is AEC-Q101 Qualified. RR264MM-400TF is small power mold type (PMDU) Standard Rectifier Diode.

Documents

Technical documentation and resources

Notes for Temperature Measurement Using Thermocouples

Thermal Design

ESD Data

Characteristics Data

Notes for Calculating Power Consumption:Static Operation

Thermal Design

Taping Information

Package Information

Measurement Method and Usage of Thermal Resistance RthJC

Thermal Design

Advantages of PMDE Compact Package with High Heat Dissipation for Automotive Schottky Barrier Diodes

Technical Article

θ<sub>JA</sub> and Ψ<sub>JT</sub>

Thermal Design

How to Select Rectifier Diodes

Technical Article

How to Select Reverse Current Protection Diodes for LDO Regulators

Schematic Design & Verification

What is a Thermal Model? (Diode)

Thermal Design

Method for Calculating Junction Temperature from Transient Thermal Resistance Data

Thermal Design

Impedance Characteristics of Bypass Capacitor

Schematic Design & Verification

Report of SVHC under REACH Regulation

Environmental Data

Compliance of the RoHS directive

Environmental Data

Package Dimensions

Package Information

Anti-Whisker formation - Diodes

Package Information

Inner Structure

Package Information

θ<sub>JC</sub> and Ψ<sub>JT</sub>

Thermal Design

Power Loss and Thermal Design of Diodes

Thermal Design

Basics of Thermal Resistance and Heat Dissipation

Thermal Design

Notes for Temperature Measurement Using Forward Voltage of PN Junction

Thermal Design

Absolute Maximum Rating and Electrical Characteristics of Diodes

Technical Article

Moisture Sensitivity Level - Diodes

Package Information

Overview of ROHM's Simulation Models(for ICs and Discrete Semiconductors)

Technical Article

About Flammability of Materials

Environmental Data

Precautions When Measuring the Rear of the Package with a Thermocouple

Thermal Design

Condition of Soldering / Land Pattern Reference

Package Information

Importance of Probe Calibration When Measuring Power: Deskew

Schematic Design & Verification

RR264MM-400TF Data Sheet

Data Sheet

Diode Types and Applications

Technical Article

What Is Thermal Design

Thermal Design

Part Explanation

Application Note

Two-Resistor Model for Thermal Simulation

Thermal Design

Judgment Criteria of Thermal Evaluation

Thermal Design

PCB Layout Thermal Design Guide

Thermal Design

Method for Monitoring Switching Waveform

Schematic Design & Verification

Explanation for Marking

Package Information

How to Use LTspice&reg; Models

Schematic Design & Verification

How to Use the Thermal Resistance and Thermal Characteristics Parameters

Thermal Design

List of Diode Package Thermal Resistance

Thermal Design

About Export Regulations

Export Information

Constitution Materials List

Environmental Data

How to Use LTspice&reg; Models: Tips for Improving Convergence

Schematic Design & Verification