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353_TO220AC__2
Discrete Semiconductor Products

RFV30TG6SGC9

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Rohm Semiconductor

DIODE SUPERFAST RECOVERY DIODE 600V 30A 2-PIN TO-220AC TUBE

353_TO220AC__2
Discrete Semiconductor Products

RFV30TG6SGC9

Active
Rohm Semiconductor

DIODE SUPERFAST RECOVERY DIODE 600V 30A 2-PIN TO-220AC TUBE

Technical Specifications

Parameters and characteristics for this part

SpecificationRFV30TG6SGC9
Current - Average Rectified (Io)30 A
Current - Reverse Leakage @ Vr10 µA
Mounting TypeThrough Hole
Operating Temperature - Junction150 ¯C
Package / CaseTO-220-2
Reverse Recovery Time (trr)60 ns
Speed500 ns, 200 mA
Supplier Device PackageTO-220ACFP
TechnologyStandard
Voltage - DC Reverse (Vr) (Max) [Max]600 V
Voltage - Forward (Vf) (Max) @ If2.8 V

Pricing

Prices provided here are for design reference only. For realtime values and availability, please visit the distributors directly

DistributorPackageQuantity$
DigikeyN/A 472$ 3.91
Tube 1$ 3.36
10$ 2.23
100$ 1.71

Description

General part information

RFV30 Series

RFV30TG6S is Super Fast Recovery Diode for general rectification.

Documents

Technical documentation and resources

Absolute Maximum Rating and Electrical Characteristics of Diodes

Technical Article

How to Use the Thermal Resistance and Thermal Characteristics Parameters

Thermal Design

Basics of Thermal Resistance and Heat Dissipation

Thermal Design

Example of Heat Dissipation Design for TO Packages: Effect of Heat Dissipation Materials

Thermal Design

Explanation for Marking

Package Information

Part Explanation

Application Note

RFV30TG6S Data Sheet

Data Sheet

How to Use LTspice® Models: Tips for Improving Convergence

Schematic Design & Verification

Reliability Test Result

Manufacturing Data

Moisture Sensitivity Level - Diodes

Package Information

Method for Monitoring Switching Waveform

Schematic Design & Verification

How to Use LTspice® Models

Schematic Design & Verification

Compliance of the RoHS directive

Environmental Data

Taping Information

Package Information

Importance of Probe Calibration When Measuring Power: Deskew

Schematic Design & Verification

About Export Regulations

Export Information

Inner Structure

Package Information

Measurement Method and Usage of Thermal Resistance RthJC

Thermal Design

Certificate of not containing SVHC under REACH Regulation

Environmental Data

Overview of ROHM's Simulation Models(for ICs and Discrete Semiconductors)

Technical Article

θ<sub>JA</sub> and Ψ<sub>JT</sub>

Thermal Design

Notes for Calculating Power Consumption:Static Operation

Thermal Design

Notes for Temperature Measurement Using Thermocouples

Thermal Design

Impedance Characteristics of Bypass Capacitor

Schematic Design & Verification

Notes for Temperature Measurement Using Forward Voltage of PN Junction

Thermal Design

θ<sub>JC</sub> and Ψ<sub>JT</sub>

Thermal Design

How to Select Reverse Current Protection Diodes for LDO Regulators

Schematic Design & Verification

What Is Thermal Design

Thermal Design

Judgment Criteria of Thermal Evaluation

Thermal Design

Anti-Whisker formation - Diodes

Package Information

List of Diode Package Thermal Resistance

Thermal Design

ESD Data

Characteristics Data

Package Dimensions

Package Information

Method for Calculating Junction Temperature from Transient Thermal Resistance Data

Thermal Design

How to Select Rectifier Diodes

Technical Article

Two-Resistor Model for Thermal Simulation

Thermal Design

Condition of Soldering / Land Pattern Reference

Package Information

Diode Types and Applications

Technical Article

Power Loss and Thermal Design of Diodes

Thermal Design

PCB Layout Thermal Design Guide

Thermal Design

Precautions When Measuring the Rear of the Package with a Thermocouple

Thermal Design

About Flammability of Materials

Environmental Data

What is a Thermal Model? (Diode)

Thermal Design