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MICROCHIP MCP1702T-5002E/MB
Discrete Semiconductor Products

2SD2661T100

Active
Rohm Semiconductor

NPN, SOT-89, 12V 2A, LOW VCE(SAT) TRANSISTOR

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MICROCHIP MCP1702T-5002E/MB
Discrete Semiconductor Products

2SD2661T100

Active
Rohm Semiconductor

NPN, SOT-89, 12V 2A, LOW VCE(SAT) TRANSISTOR

Deep-Dive with AI

Technical Specifications

Parameters and characteristics for this part

Specification2SD2661T100
Current - Collector (Ic) (Max) [Max]2 A
Current - Collector Cutoff (Max) [Max]100 nA
DC Current Gain (hFE) (Min) @ Ic, Vce [Min]270
Frequency - Transition360 MHz
Mounting TypeSurface Mount
Operating Temperature150 °C
Package / CaseTO-243AA
Power - Max [Max]2 W
Supplier Device PackageMPT3
Transistor TypeNPN
Vce Saturation (Max) @ Ib, Ic180 mV
Voltage - Collector Emitter Breakdown (Max) [Max]12 V

Pricing

Prices provided here are for design reference only. For realtime values and availability, please visit the distributors directly

DistributorPackageQuantity$
DigikeyCut Tape (CT) 1$ 0.95
10$ 0.59
100$ 0.39
500$ 0.30
Digi-Reel® 1$ 0.95
10$ 0.59
100$ 0.39
500$ 0.30
N/A 385$ 0.94
Tape & Reel (TR) 1000$ 0.27
2000$ 0.24
3000$ 0.23
5000$ 0.22
7000$ 0.21
10000$ 0.20
25000$ 0.18
NewarkEach (Supplied on Cut Tape) 1$ 0.95
10$ 0.60
25$ 0.54
50$ 0.47
100$ 0.40
250$ 0.35
500$ 0.31
1000$ 0.27

Description

General part information

2SD2661 Series

Various products are available in lineup developed focusing on energy-saving and high reliability as main concepts, covering from ultra-compact packages to power-packages to meet the needs in market.

Documents

Technical documentation and resources

Technical Data Sheet EN

Datasheet

MPT3 Part Marking

Related Document

Transistor, MOSFET Flammability

Related Document

MPT3 T100 Taping Spec

Datasheet

Anti-Whisker formation - Transistors

Package Information

Report of SVHC under REACH Regulation

Environmental Data

Impedance Characteristics of Bypass Capacitor

Schematic Design & Verification

What is a Thermal Model? (Transistor)

Thermal Design

List of Transistor Package Thermal Resistance

Thermal Design

Method for Monitoring Switching Waveform

Schematic Design & Verification

How to Use LTspice® Models

Schematic Design & Verification

Types and Features of Transistors

Application Note

PCB Layout Thermal Design Guide

Thermal Design

About Export Regulations

Export Information

Method for Calculating Junction Temperature from Transient Thermal Resistance Data

Thermal Design

2SD2661 ESD Data

Characteristics Data

Notes for Temperature Measurement Using Forward Voltage of PN Junction

Thermal Design

Precautions When Measuring the Rear of the Package with a Thermocouple

Thermal Design

Calculation of Power Dissipation in Switching Circuit

Schematic Design & Verification

Temperature derating method for Safe Operating Area (SOA)

Schematic Design & Verification

Importance of Probe Calibration When Measuring Power: Deskew

Schematic Design & Verification

2SD2661 Thermal Resistance

Characteristics Data

Package Dimensions

Package Information

Measurement Method and Usage of Thermal Resistance RthJC

Thermal Design

Inner Structure

Package Information

How to Create Symbols for PSpice Models

Models

Overview of ROHM's Simulation Models(for ICs and Discrete Semiconductors)

Technical Article

What Is Thermal Design

Thermal Design

Reliability Test Result

Manufacturing Data

Notes for Calculating Power Consumption:Static Operation

Thermal Design

Basics of Thermal Resistance and Heat Dissipation

Thermal Design

Two-Resistor Model for Thermal Simulation

Thermal Design

Condition of Soldering / Land Pattern Reference

Package Information

Compliance of the RoHS directive

Environmental Data

Notes for Temperature Measurement Using Thermocouples

Thermal Design

Moisture Sensitivity Level - Transistors

Package Information

2SD2661 Data Sheet

Data Sheet

How to Use LTspice® Models: Tips for Improving Convergence

Schematic Design & Verification

Part Explanation

Application Note