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RGS50TSX2GC11
Discrete Semiconductor Products

RGS50TSX2GC11

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Rohm Semiconductor

10ΜS SHORT-CIRCUIT TOLERANCE, 1200V 25A, FIELD STOP TRENCH IGBT

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RGS50TSX2GC11
Discrete Semiconductor Products

RGS50TSX2GC11

Active
Rohm Semiconductor

10ΜS SHORT-CIRCUIT TOLERANCE, 1200V 25A, FIELD STOP TRENCH IGBT

Technical Specifications

Parameters and characteristics for this part

SpecificationRGS50TSX2GC11
Current - Collector (Ic) (Max) [Max]50 A
Current - Collector Pulsed (Icm)75 A
Gate Charge67 nC
IGBT TypeTrench Field Stop
Mounting TypeThrough Hole
Operating Temperature [Max]175 °C
Operating Temperature [Min]-40 °C
Package / CaseTO-247-3
Power - Max [Max]395 W
Supplier Device PackageTO-247N
Switching Energy1.65 mJ, 1.4 mJ
Td (on/off) @ 25°C [custom]140 ns
Td (on/off) @ 25°C [custom]37 ns
Test Condition25 A, 600 V, 10 Ohm, 15 V
Vce(on) (Max) @ Vge, Ic2.1 V
Voltage - Collector Emitter Breakdown (Max) [Max]1200 V

Pricing

Prices provided here are for design reference only. For realtime values and availability, please visit the distributors directly

DistributorPackageQuantity$
DigikeyN/A 131$ 9.07
NewarkEach 1$ 5.69
10$ 4.58
25$ 4.21
50$ 4.21
100$ 4.21
250$ 4.20
900$ 4.20

Description

General part information

RGS50TSX2 Series

The RGS50TSX2 is a 10µs SCSOA guaranteed IGBT, suitable for PFC, UPS, IH and Power Conditioner. The RGS series delivers low conduction loss that contributes to reducing size and to improving efficiency of applications.

Documents

Technical documentation and resources

Technical Data Sheet EN

Datasheet

Two-Resistor Model for Thermal Simulation

Thermal Design

Measurement Method and Usage of Thermal Resistance RthJC

Thermal Design

θ<sub>JA</sub> and Ψ<sub>JT</sub>

Thermal Design

What Is Thermal Design

Thermal Design

Method for Calculating Junction Temperature from Transient Thermal Resistance Data

Thermal Design

Compliance of the ELV directive

Environmental Data

Calculation of Power Dissipation in Switching Circuit

Schematic Design & Verification

How to Use the Thermal Resistance and Thermal Characteristics Parameters

Thermal Design

Power Eco Family: Overview of ROHM's Power Semiconductor Lineup

White Paper

PCB Layout Thermal Design Guide

Thermal Design

Anti-Whisker formation

Package Information

Impedance Characteristics of Bypass Capacitor

Schematic Design & Verification

Judgment Criteria of Thermal Evaluation

Thermal Design

Semikron Danfoss: Partnering for the Safe Supply of Industrial Power Modules

White Paper

Notes for Temperature Measurement Using Forward Voltage of PN Junction

Thermal Design

About Export Administration Regulations (EAR)

Export Information

How to Use LTspice&reg; Models: Tips for Improving Convergence

Schematic Design & Verification

Example of Heat Dissipation Design for TO Packages: Effect of Heat Dissipation Materials

Thermal Design

Package Dimensions

Package Information

4 Steps for Successful Thermal Designing of Power Devices

White Paper

Basics of Thermal Resistance and Heat Dissipation

Thermal Design

θ<sub>JC</sub> and Ψ<sub>JT</sub>

Thermal Design

Types and Features of Transistors

Application Note

How to Use LTspice&reg; Models

Schematic Design & Verification

Importance of Probe Calibration When Measuring Power: Deskew

Schematic Design & Verification

Generation Mechanism of Voltage Surge on Commutation Side (Basic)

Technical Article

What is a Thermal Model? (IGBT)

Thermal Design

Notes for Temperature Measurement Using Thermocouples

Thermal Design

Overview of ROHM's Simulation Models(for ICs and Discrete Semiconductors)

Technical Article

Moisture Sensitivity Level

Package Information

Part Explanation

Application Note

About Flammability of Materials

Environmental Data

Estimation of switching losses in IGBTs operating with resistive load

Schematic Design & Verification

How to Create Symbols for PSpice Models

Models

Method for Monitoring Switching Waveform

Schematic Design & Verification

Precautions for Thermal Resistance of Insulation Sheet

Thermal Design

Notes for Calculating Power Consumption:Static Operation

Thermal Design

Precautions When Measuring the Rear of the Package with a Thermocouple

Thermal Design

The Problem with Traditional Vaccine Storage Freezers and How ROHM Cutting-edge Power Solutions Can Take them to the Next Level

White Paper