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Discrete Semiconductor Products

2SCR582D3TL1

Active
Rohm Semiconductor

TRANS, BIPOLAR, NPN, 30V, 10A, 10W/TO252 ROHS COMPLIANT: YES

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Product dimension image
Discrete Semiconductor Products

2SCR582D3TL1

Active
Rohm Semiconductor

TRANS, BIPOLAR, NPN, 30V, 10A, 10W/TO252 ROHS COMPLIANT: YES

Technical Specifications

Parameters and characteristics for this part

Specification2SCR582D3TL1
Current - Collector Cutoff (Max) [Max]1 µA
DC Current Gain (hFE) (Min) @ Ic, Vce [Min]200
Frequency - Transition250 MHz
Mounting TypeSurface Mount
Operating Temperature150 °C
Package / CaseTO-252-3, SC-63, DPAK (2 Leads + Tab)
Power - Max [Max]10 W
Supplier Device PackageTO-252
Transistor TypeNPN
Vce Saturation (Max) @ Ib, Ic350 mV
Voltage - Collector Emitter Breakdown (Max) [Max]30 V

Pricing

Prices provided here are for design reference only. For realtime values and availability, please visit the distributors directly

DistributorPackageQuantity$
DigikeyCut Tape (CT) 1$ 1.49
10$ 0.95
100$ 0.64
500$ 0.56
Digi-Reel® 1$ 1.49
10$ 0.95
100$ 0.64
500$ 0.56
N/A 5440$ 2.10
Tape & Reel (TR) 2500$ 0.56
NewarkEach (Supplied on Cut Tape) 1$ 1.49
10$ 1.38
25$ 1.24
50$ 1.10
100$ 0.96
250$ 0.92
500$ 0.88

Description

General part information

2SCR582D3 Series

2SCR582D3 is a power transistor with Low VCE(sat), suitable for low frequency amplifier.

Documents

Technical documentation and resources

Notes for Calculating Power Consumption:Static Operation

Thermal Design

TO-252_TL1 Taping Information

Package Information

What Is Thermal Design

Thermal Design

Example of Heat Dissipation Design for TO Packages: Effect of Heat Dissipation Materials

Thermal Design

2SCR582D3 Data Sheet

Data Sheet

Temperature derating method for Safe Operating Area (SOA)

Schematic Design & Verification

Measurement Method and Usage of Thermal Resistance RthJC

Thermal Design

Two-Resistor Model for Thermal Simulation

Thermal Design

2SCR582D3 ESD Data

Characteristics Data

Precautions When Measuring the Rear of the Package with a Thermocouple

Thermal Design

Explanation for Marking

Package Information

How to Create Symbols for PSpice Models

Models

Importance of Probe Calibration When Measuring Power: Deskew

Schematic Design & Verification

About Export Regulations

Export Information

What is a Thermal Model? (Transistor)

Thermal Design

How to Use LTspice® Models: Tips for Improving Convergence

Schematic Design & Verification

Part Explanation

Application Note

PCB Layout Thermal Design Guide

Thermal Design

Moisture Sensitivity Level - Transistors

Package Information

Anti-Whisker formation - Transistors

Package Information

Notes for Temperature Measurement Using Forward Voltage of PN Junction

Thermal Design

Package Dimensions

Package Information

Overview of ROHM's Simulation Models(for ICs and Discrete Semiconductors)

Technical Article

Method for Monitoring Switching Waveform

Schematic Design & Verification

Condition of Soldering / Land Pattern Reference

Package Information

Calculation of Power Dissipation in Switching Circuit

Schematic Design & Verification

Report of SVHC under REACH Regulation

Environmental Data

Types and Features of Transistors

Application Note

List of Transistor Package Thermal Resistance

Thermal Design

How to Use LTspice® Models

Schematic Design & Verification

About Flammability of Materials

Environmental Data

Basics of Thermal Resistance and Heat Dissipation

Thermal Design

Impedance Characteristics of Bypass Capacitor

Schematic Design & Verification

Compliance of the RoHS directive

Environmental Data

Notes for Temperature Measurement Using Thermocouples

Thermal Design

Method for Calculating Junction Temperature from Transient Thermal Resistance Data

Thermal Design

2SCR582D3 Thermal Resistance

Characteristics Data