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SH8MB5TB1
Discrete Semiconductor Products

SH8MB5TB1

Active
Rohm Semiconductor

DUAL MOSFET, N & P-CH, 40V, 8.5A, SOP ROHS COMPLIANT: YES

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SH8MB5TB1
Discrete Semiconductor Products

SH8MB5TB1

Active
Rohm Semiconductor

DUAL MOSFET, N & P-CH, 40V, 8.5A, SOP ROHS COMPLIANT: YES

Technical Specifications

Parameters and characteristics for this part

SpecificationSH8MB5TB1
ConfigurationN and P-Channel
Current - Continuous Drain (Id) @ 25°C8.5 A
Drain to Source Voltage (Vdss)40 V
Gate Charge (Qg) (Max) @ Vgs51 nC, 10.6 nC
Input Capacitance (Ciss) (Max) @ Vds530 pF, 2870 pF
Mounting TypeSurface Mount
Operating Temperature150 °C
Package / Case0.154 in
Package / Case8-SOIC
Package / Case3.9 mm
Power - Max [Max]2 W
Rds On (Max) @ Id, Vgs19.4 mOhm, 16.8 mOhm
Supplier Device Package8-SOP
TechnologyMOSFET (Metal Oxide)
Vgs(th) (Max) @ Id2.5 V

Pricing

Prices provided here are for design reference only. For realtime values and availability, please visit the distributors directly

DistributorPackageQuantity$
DigikeyN/A 8279$ 2.22
NewarkEach (Supplied on Cut Tape) 1$ 2.39
10$ 1.56
25$ 1.39
50$ 1.24
100$ 1.07
250$ 0.96
500$ 0.85
1000$ 0.79

Description

General part information

SH8MB5 Series

SH8MB5 is a low on-resistance MOSFET ideal for switching applications. The small surface mounting package (SOP8) contributes to space saving.

Documents

Technical documentation and resources

SH8MB5 Data Sheet

Data Sheet

Condition of Soldering / Land Pattern Reference

Package Information

Types and Features of Transistors

Application Note

SOP8 Dual Cu Inner Structure

Package Information

About Export Regulations

Export Information

Certificate of not containing SVHC under REACH Regulation

Environmental Data

About Flammability of Materials

Environmental Data

Measurement Method and Usage of Thermal Resistance RthJC

Thermal Design

SH8MB5 ESD Data

Characteristics Data

What is a Thermal Model? (Transistor)

Thermal Design

Notes for Temperature Measurement Using Forward Voltage of PN Junction

Thermal Design

Importance of Probe Calibration When Measuring Power: Deskew

Schematic Design & Verification

How to Use LTspice® Models: Tips for Improving Convergence

Schematic Design & Verification

Method for Calculating Junction Temperature from Transient Thermal Resistance Data

Thermal Design

Taping Information

Package Information

Overview of ROHM's Simulation Models(for ICs and Discrete Semiconductors)

Technical Article

PCB Layout Thermal Design Guide

Thermal Design

List of Transistor Package Thermal Resistance

Thermal Design

What Is Thermal Design

Thermal Design

Calculation of Power Dissipation in Switching Circuit

Schematic Design & Verification

Method for Monitoring Switching Waveform

Schematic Design & Verification

Reliability Test Result

Manufacturing Data

Moisture Sensitivity Level - Transistors

Package Information

Package Dimensions

Package Information

Part Explanation

Application Note

Explanation for Marking

Package Information

Impedance Characteristics of Bypass Capacitor

Schematic Design & Verification

Precautions When Measuring the Rear of the Package with a Thermocouple

Thermal Design

Notes for Calculating Power Consumption:Static Operation

Thermal Design

Anti-Whisker formation - Transistors

Package Information

Two-Resistor Model for Thermal Simulation

Thermal Design

Basics of Thermal Resistance and Heat Dissipation

Thermal Design

How to Create Symbols for PSpice Models

Models

MOSFET Gate Resistor Setting for Motor Driving

Technical Article

How to Use LTspice® Models

Schematic Design & Verification

P-channel Power MOSFETs selection guide

Technical Article

Compliance of the RoHS directive

Environmental Data

MOSFET Gate Drive Current Setting for Motor Driving

Technical Article

Temperature derating method for Safe Operating Area (SOA)

Schematic Design & Verification

Notes for Temperature Measurement Using Thermocouples

Thermal Design

Technical Data Sheet EN

Datasheet