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HSDIP25
Discrete Semiconductor Products

BM63577S-VA

Active
Rohm Semiconductor

INTELLIGENT POWER MODULE (IPM), IGBT, 600 V, 30 A, 1.5 KV, DIPIPM

Deep-Dive with AI

Search across all available documentation for this part.

DocumentsMethod for Monitoring Switching Waveformθ<sub>JC</sub> and Ψ<sub>JT</sub>+22
HSDIP25
Discrete Semiconductor Products

BM63577S-VA

Active
Rohm Semiconductor

INTELLIGENT POWER MODULE (IPM), IGBT, 600 V, 30 A, 1.5 KV, DIPIPM

Deep-Dive with AI

DocumentsMethod for Monitoring Switching Waveformθ<sub>JC</sub> and Ψ<sub>JT</sub>+22

Technical Specifications

Parameters and characteristics for this part

SpecificationBM63577S-VA
Configuration3 Phase Inverter
Current30 A
Mounting TypeThrough Hole
Package / Case25-PowerDIP Module (1.134", 28.80mm)
TypeIGBT
Voltage600 V
Voltage - Isolation1500 VAC

Pricing

Prices provided here are for design reference only. For realtime values and availability, please visit the distributors directly

DistributorPackageQuantity$
DigikeyN/A 0$ 29.82
Tube 1$ 10.62
60$ 7.81
NewarkEach 1$ 18.73
5$ 18.04
10$ 17.38
25$ 16.79
50$ 16.26
120$ 15.94
300$ 15.66

Description

General part information

BM63577 Series

BM63577S-VA/-VC is an Intelligent Power Module composed of gate drivers, bootstrap diodes, IGBTs, fly wheel diodes.

Documents

Technical documentation and resources

Method for Monitoring Switching Waveform

Schematic Design & Verification

θ<sub>JC</sub> and Ψ<sub>JT</sub>

Thermal Design

Compliance of the ELV directive

Environmental Data

Notes for Temperature Measurement Using Forward Voltage of PN Junction

Thermal Design

θ<sub>JA</sub> and Ψ<sub>JT</sub>

Thermal Design

Precautions for Thermal Resistance of Insulation Sheet

Thermal Design

How to Use the Thermal Resistance and Thermal Characteristics Parameters

Thermal Design

Impedance Characteristics of Bypass Capacitor

Schematic Design & Verification

Notes for Calculating Power Consumption:Static Operation

Thermal Design

Anti-Whisker formation

Package Information

4 Steps for Successful Thermal Designing of Power Devices

White Paper

Overview of ROHM's Simulation Models(for ICs and Discrete Semiconductors)

Technical Article

Judgment Criteria of Thermal Evaluation

Thermal Design

Importance of Probe Calibration When Measuring Power: Deskew

Schematic Design & Verification

Method for Calculating Junction Temperature from Transient Thermal Resistance Data

Thermal Design

What Is Thermal Design

Thermal Design

About Flammability of Materials

Environmental Data

600V IGBT Gen.3 Intelligent Power Module (IPM) BM6337*S, BM6357*S Series Application Note

Application Note

PCB Layout Thermal Design Guide

Thermal Design

The Problem with Traditional Vaccine Storage Freezers and How ROHM Cutting-edge Power Solutions Can Take them to the Next Level

White Paper

BM63577S-VA Data Sheet

Data Sheet

About Export Administration Regulations (EAR)

Export Information

Notes for Temperature Measurement Using Thermocouples

Thermal Design

Basics of Thermal Resistance and Heat Dissipation

Thermal Design