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RFNL20TJ6SFHGC9
Discrete Semiconductor Products

RFNL20TJ6SFHGC9

Active
Rohm Semiconductor

FAST RECT DIODE, 600V, 20A, TO-220ACFP ROHS COMPLIANT: YES

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RFNL20TJ6SFHGC9
Discrete Semiconductor Products

RFNL20TJ6SFHGC9

Active
Rohm Semiconductor

FAST RECT DIODE, 600V, 20A, TO-220ACFP ROHS COMPLIANT: YES

Technical Specifications

Parameters and characteristics for this part

SpecificationRFNL20TJ6SFHGC9
Current - Reverse Leakage @ Vr10 nA
GradeAutomotive
Mounting TypeThrough Hole
Operating Temperature - Junction150 ¯C
Package / CaseTO-220-2 Full Pack
QualificationAEC-Q101
Reverse Recovery Time (trr)180 ns
Speed500 ns, 200 mA
Supplier Device PackageTO-220ACFP
TechnologyStandard
Voltage - DC Reverse (Vr) (Max) [Max]600 V
Voltage - Forward (Vf) (Max) @ If1.3 V

Pricing

Prices provided here are for design reference only. For realtime values and availability, please visit the distributors directly

DistributorPackageQuantity$
DigikeyN/A 985$ 3.71
NewarkEach 1$ 3.04
10$ 2.58
100$ 2.07
500$ 1.91
1000$ 1.72
3000$ 1.39
5000$ 1.34

Description

General part information

RFNL20TJ6SFHG Series

RFNL20TJ6SFHG is the high reliability Automotive Fast Recovery Diode, suitable for PFC & general rectification.

Documents

Technical documentation and resources

Absolute Maximum Rating and Electrical Characteristics of Diodes

Technical Article

Certificate of not containing SVHC under REACH Regulation

Environmental Data

What is a Thermal Model? (Diode)

Thermal Design

Condition of Soldering / Land Pattern Reference

Package Information

Basics of Thermal Resistance and Heat Dissipation

Thermal Design

Judgment Criteria of Thermal Evaluation

Thermal Design

Notes for Temperature Measurement Using Forward Voltage of PN Junction

Thermal Design

Notes for Calculating Power Consumption:Static Operation

Thermal Design

Measurement Method and Usage of Thermal Resistance RthJC

Thermal Design

PCB Layout Thermal Design Guide

Thermal Design

Precautions When Measuring the Rear of the Package with a Thermocouple

Thermal Design

Method for Monitoring Switching Waveform

Schematic Design & Verification

Taping Information

Package Information

Example of Heat Dissipation Design for TO Packages: Effect of Heat Dissipation Materials

Thermal Design

Impedance Characteristics of Bypass Capacitor

Schematic Design & Verification

θ<sub>JC</sub> and Ψ<sub>JT</sub>

Thermal Design

About Export Regulations

Export Information

Package Dimensions

Package Information

Power Loss and Thermal Design of Diodes

Thermal Design

How to Use LTspice&reg; Models

Schematic Design & Verification

Overview of ROHM's Simulation Models(for ICs and Discrete Semiconductors)

Technical Article

Reliability Test Result

Manufacturing Data

Importance of Probe Calibration When Measuring Power: Deskew

Schematic Design & Verification

Moisture Sensitivity Level - Diodes

Package Information

Diode Types and Applications

Technical Article

What Is Thermal Design

Thermal Design

How to Select Reverse Current Protection Diodes for LDO Regulators

Schematic Design & Verification

Anti-Whisker formation - Diodes

Package Information

List of Diode Package Thermal Resistance

Thermal Design

Part Explanation

Application Note

RFNL20TJ6SFHG ESD Data

Characteristics Data

Two-Resistor Model for Thermal Simulation

Thermal Design

RFNL20TJ6SFHG Data Sheet

Data Sheet

How to Select Rectifier Diodes

Technical Article

How to Use LTspice&reg; Models: Tips for Improving Convergence

Schematic Design & Verification

θ<sub>JA</sub> and Ψ<sub>JT</sub>

Thermal Design

About Flammability of Materials

Environmental Data

Method for Calculating Junction Temperature from Transient Thermal Resistance Data

Thermal Design

Inner Structure

Package Information

Compliance of the RoHS directive

Environmental Data

Notes for Temperature Measurement Using Thermocouples

Thermal Design

How to Use the Thermal Resistance and Thermal Characteristics Parameters

Thermal Design