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80-TQFP Exp Pad 21-0115
Integrated Circuits (ICs)

MAX9972ACCS+D

Active
Analog Devices Inc./Maxim Integrated

QUAD, ULTRA-LOW-POWER, 300MBPS ATE DRIVERS/COMPARATORS

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80-TQFP Exp Pad 21-0115
Integrated Circuits (ICs)

MAX9972ACCS+D

Active
Analog Devices Inc./Maxim Integrated

QUAD, ULTRA-LOW-POWER, 300MBPS ATE DRIVERS/COMPARATORS

Technical Specifications

Parameters and characteristics for this part

SpecificationMAX9972ACCS+D
Logic TypeDriver, Comparator
Mounting TypeSurface Mount
Number of Bits4
Operating Temperature [Max]70 °C
Operating Temperature [Min]0 °C
Package / Case80-TQFP Exposed Pad
Supplier Device Package80-TQFP-EP (12x12)
Supply Voltage [Max]5.2 V
Supply Voltage [Min]-2.2 V

Pricing

Prices provided here are for design reference only. For realtime values and availability, please visit the distributors directly

DistributorPackageQuantity$
DigikeyN/A 0$ 64.67
Tray 10$ 64.48

Description

General part information

MAX9972 Series

The MAX9972 four-channel, ultra-low-power, pin-electronics IC includes, for each channel, a three-level pin driver, a window comparator, a passive load, and force-and-sense Kelvin-switched parametric measurement unit (PMU) connections. The driver features a -2.2V to +5.2V voltage range, includes high-impedance and active-termination (3rd-level drive) modes, and is highly linear even at low voltage swings. The window comparator features 500MHz equivalent input bandwidth and programmable output voltage levels. The passive load provides pullup and pulldown voltages to the device-under-test (DUT).Low-leakage, high-impedance, and terminate controls are operational configurations that are programmed through a 3-wire, low-voltage, CMOS-compatible serial interface. High-speed PMU switching is realized through dedicated digital control inputs.This device is available in an 80-pin, 12mm x 12mm body, 0.50mm pitch TQFP with an exposed 6mm x 6mm die pad on the bottom of the package for efficient heat removal. The MAX9972 is specified to operate over the 0°C to +70°C commercial temperature range, and features a die temperature monitor output.ApplicationsActive Burn-In SystemsDRAM Probe TestersLow-Cost Mixed-Signal/System-on-Chip (SoC) TestersNAND Flash TestersStructural Testers