Discrete Semiconductor Products

PBSS5330PAS-QX

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30 V, 3 A PNP LOW VCESAT TRANSISTOR

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DocumentsPBSS5330PAS-QX | Datasheet plastic, thermal enhanced ultra thin small outline package; no leads; 3 terminals; 1.3 mm pitch; 2 mm x 2 mm x 0.65 mm body +8

Discrete Semiconductor Products

PBSS5330PAS-QX

Active

Nexperia USA Inc.

30 V, 3 A PNP LOW VCESAT TRANSISTOR

Deep-Dive with AI

DocumentsPBSS5330PAS-QX | Datasheet plastic, thermal enhanced ultra thin small outline package; no leads; 3 terminals; 1.3 mm pitch; 2 mm x 2 mm x 0.65 mm body +8

Specifications Series Pricing Description Documents

Technical Specifications

Parameters and characteristics for this part

Specification	PBSS5330PAS-QX

Current - Collector (Ic) (Max) [Max]	3 A
Current - Collector Cutoff (Max) [Max]	100 nA
DC Current Gain (hFE) (Min) @ Ic, Vce	200
Frequency - Transition	165 MHz
Grade	Automotive
Mounting Type	Surface Mount
Operating Temperature	175 °C
Package / Case	3-UDFN Exposed Pad
Power - Max [Max]	0.6 W
Qualification	AEC-Q101
Supplier Device Package	DFN2020D-3
Transistor Type	PNP
Vce Saturation (Max) @ Ib, Ic	320 mV
Voltage - Collector Emitter Breakdown (Max) [Max]	30 V

PBSS5330PAS-Q Series

30 V, 3 A PNP low VCEsat transistor

Part	Supplier Device Package	Package / Case	Transistor Type	Voltage - Collector Emitter Breakdown (Max) [Max]	Grade	Operating Temperature	Frequency - Transition	Qualification	Mounting Type	Current - Collector Cutoff (Max) [Max]	Power - Max [Max]	Vce Saturation (Max) @ Ib, Ic	Current - Collector (Ic) (Max) [Max]	DC Current Gain (hFE) (Min) @ Ic, Vce
Nexperia USA Inc. PBSS5330PAS-QX	DFN2020D-3	3-UDFN Exposed Pad	PNP	30 V	Automotive	175 °C	165 MHz	AEC-Q101	Surface Mount	100 nA	0.6 W	320 mV	3 A	200

Pricing

Prices provided here are for design reference only. For realtime values and availability, please visit the distributors directly

Distributor	Package	Quantity	$

Digikey	N/A	0	$ 0.20

Description

General part information

PBSS5330PAS-Q Series

PNP low VCEsattransistor, encapsulated in an DFN2020D-3 (SOT1061D) ultra thin leadless small Surface-Mounted Device (SMD) plastic package with medium power capability and visible and solderable side pads.