Deep-Dive with AI
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Deep-Dive with AI
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Technical Specifications
Parameters and characteristics for this part
| Specification | HDC-H105-31S1-TG30 |
|---|---|
| Color | Black |
| Connector Style | High Density (HDC, HDI, HPC) |
| Connector Type | Header, Male Pins |
| Connector Usage | Backplane |
| Contact Finish | Gold |
| Contact Finish Thickness | 30 Áin |
| Contact Finish Thickness | 0.76 Ám |
| Current Rating (Amps) | 3 A |
| Material Flammability Rating | UL94 V-0 |
| Mounting Type | Through Hole |
| Number of Positions | 105 |
| Number of Positions Loaded | All |
| Number of Rows [custom] | 3 |
| Operating Temperature [Max] | 105 ░C |
| Operating Temperature [Min] | -55 C |
| Pitch | 0.1 " |
| Pitch | 2.54 mm |
| Termination | Solder |
| Part | Current Rating (Amps) | Operating Temperature [Min] | Operating Temperature [Max] | Material Flammability Rating | Connector Type | Number of Positions | Contact Finish | Connector Style | Color | Termination | Pitch | Pitch | Contact Finish Thickness | Contact Finish Thickness | Connector Usage | Mounting Type | Number of Positions Loaded | Number of Rows [custom] | Number of Positions [custom] |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
3M Electronic Specialty | 3 A | -55 C | 105 ░C | UL94 V-0 | Header Male Pins | 128 | Gold | High Density (HDC HDI HPC) | Black | Solder | 0.1 " | 2.54 mm | 30 Áin | 0.76 Ám | Backplane | Through Hole | All | ||
3M Electronic Specialty | 3 A | -55 C | 105 ░C | UL94 V-0 | Header Male Pins | 105 | Gold | High Density (HDC HDI HPC) | Black | Solder | 0.1 " | 2.54 mm | 30 Áin | 0.76 Ám | Backplane | Through Hole | All | 3 | |
3M Electronic Specialty | 3 A | -55 C | 105 ░C | UL94 V-0 | Header Male Pins | 180 | Gold | High Density (HDC HDI HPC) | Black | Solder | 0.1 " | 2.54 mm | 30 Áin | 0.76 Ám | Backplane | Through Hole | All | ||
3M Electronic Specialty | 3 A | -55 C | 105 ░C | UL94 V-0 | Header Male Pins | Gold | High Density (HDC HDI HPC) | Black | Solder | 0.1 " | 2.54 mm | 30 Áin | 0.76 Ám | Backplane | Through Hole | All | 240 | ||
3M Electronic Specialty | 3 A | -55 C | 105 ░C | UL94 V-0 | Header Male Pins | 180 | Gold | High Density (HDC HDI HPC) | Black | Solder | 0.1 " | 2.54 mm | 30 Áin | 0.76 Ám | Backplane | Through Hole | All | ||
3M Electronic Specialty | 3 A | -55 C | 105 ░C | UL94 V-0 | Header Male Pins | 140 | Gold | High Density (HDC HDI HPC) | Black | Press-Fit | 0.1 " | 2.54 mm | 30 Áin | 0.76 Ám | Backplane | Through Hole | All | ||
3M Electronic Specialty | 3 A | -55 C | 105 ░C | UL94 V-0 | Header Male Pins | 180 | Gold | High Density (HDC HDI HPC) | Black | Solder | 0.1 " | 2.54 mm | 30 Áin | 0.76 Ám | Backplane | Through Hole | All |
Pricing
Prices provided here are for design reference only. For realtime values and availability, please visit the distributors directly
| Distributor | Package | Quantity | $ | |
|---|---|---|---|---|
| Digikey | N/A | 0 | $ 8.75 | |
Description
General part information
HDC-H Series
105 Connector Header, Male Pins Through Hole Black High Density (HDC, HDI, HPC)
Documents
Technical documentation and resources