STM32MP157CMPU with Arm Dual Cortex-A7 650 MHz, Arm Cortex-M4 real-time coprocessor, 3D GPU, TFT/MIPI DSI displays, FD-CAN, Secure boot and Cryptography | Microprocessors | 5 | Active | The STM32MP157C/F devices are based on the high-performance dual-core Arm®Cortex®-A7 32-bit RISC core operating at up to 800 MHz. The Cortex-A7 processor includes a 32-Kbyte L1 instruction cache for each CPU, a 32-Kbyte L1 data cache for each CPU and a 256-Kbyte level2 cache. The Cortex-A7 processor is a very energy-efficient application processor designed to provide rich performance in high-end wearables, and other low-power embedded and consumer applications. It provides up to 20% more single thread performance than the Cortex-A5 and provides similar performance than the Cortex-A9.
The Cortex-A7 incorporates all features of the high-performance Cortex-A15 and Cortex-A17 processors, including virtualization support in hardware, NEON™, and 128-bit AMBA®4 AXI bus interface.
The STM32MP157C/F devices also embed a Cortex®-M4 32-bit RISC core operating at up to 209 MHz frequency. Cortex-M4 core features a floating point unit (FPU) single precision which supports Arm®single-precision data-processing instructions and data types. The Cortex®-M4 supports a full set of DSP instructions and a memory protection unit (MPU) which enhances application security.
The STM32MP157C/F devices also embed a 3D graphic processing unit (Vivante®- OpenGL®ES 2.0) running at up to 533 MHz, with performances up to 26 Mtriangle/s, 133 Mpixel/s.
The STM32MP157C/F devices provide an external SDRAM interface supporting external memories up to 8-Gbit density (1 Gbyte), 16 or 32-bit LPDDR2/LPDDR3 or DDR3/DDR3L up to 533 MHz.
The STM32MP157C/F devices incorporate high-speed embedded memories with 708 Kbytes of Internal SRAM (including 256 Kbytes of AXI SYSRAM, 3 banks of 128 Kbytes each of AHB SRAM, 64 Kbytes of AHB SRAM in backup domain and 4 Kbytes of SRAM in backup domain), as well as an extensive range of enhanced I/Os and peripherals connected to APB buses, AHB buses, a 32-bit multi-AHB bus matrix and a 64-bit multi layer AXI interconnect supporting internal and external memories access.
All the devices offer two ADCs, two DACs, a low-power RTC, 12 general-purpose 16-bit timers, two PWM timers for motor control, five low-power timers, a true random number generator (RNG), and a cryptographic acceleration cell. The devices support six digital filters for external sigma delta modulators (DFSDM). They also feature standard and advanced communication interfaces. |
STM32MP157DMPU with Arm Dual Cortex-A7 800 MHz, Arm Cortex-M4 real-time coprocessor, 3D GPU, TFT/MIPI DSI displays, FD-CAN | Microprocessors | 3 | Active | The STM32MP157A/D devices are based on the high-performance dual-core Arm®Cortex®-A7 32-bit RISC core operating at up to 800 MHz. The Cortex-A7 processor includes a 32-Kbyte L1 instruction cache for each CPU, a 32-Kbyte L1 data cache for each CPU and a 256-Kbyte level2 cache. The Cortex-A7 processor is a very energy-efficient application processor designed to provide rich performance in high-end wearables, and other low-power embedded and consumer applications. It provides up to 20% more single thread performance than the Cortex-A5 and provides similar performance than the Cortex-A9.
The Cortex-A7 incorporates all features of the high-performance Cortex-A15 and Cortex-A17 processors, including virtualization support in hardware, NEON™, and 128-bit AMBA®4 AXI bus interface.
The STM32MP157A/D devices also embed a Cortex®-M4 32-bit RISC core operating at up to 209 MHz frequency. Cortex-M4 core features a floating point unit (FPU) single precision which supports Arm®single-precision data-processing instructions and data types. The Cortex®-M4 supports a full set of DSP instructions and a memory protection unit (MPU) which enhances application security.
The STM32MP157A/D devices also embed a 3D graphic processing unit (Vivante®- OpenGL®ES 2.0) running at up to 533 MHz, with performances up to 26 Mtriangle/s, 133 Mpixel/s.
The STM32MP157A/D devices provide an external SDRAM interface supporting external memories up to 8-Gbit density (1 Gbyte), 16 or 32-bit LPDDR2/LPDDR3 or DDR3/DDR3L up to 533 MHz.
The STM32MP157A/D devices incorporate high-speed embedded memories with 708 Kbytes of Internal SRAM (including 256 Kbytes of AXI SYSRAM, 3 banks of 128 Kbytes each of AHB SRAM, 64 Kbytes of AHB SRAM in backup domain and 4 Kbytes of SRAM in backup domain), as well as an extensive range of enhanced I/Os and peripherals connected to APB buses, AHB buses, a 32-bit multi-AHB bus matrix and a 64-bit multi layer AXI interconnect supporting internal and external memories access.
All the devices offer two ADCs, two DACs, a low-power RTC, 12 general-purpose 16-bit timers, two PWM timers for motor control, five low-power timers, a true random number generator (RNG). The devices support six digital filters for external sigma delta modulators (DFSDM). They also feature standard and advanced communication interfaces. |
| Embedded MCU, DSP Evaluation Boards | 1 | Active | The STM32MP157D-DK1 and STM32MP157F-DK2 Discovery kits leverage the capabilities of the increased-frequency 800 MHz microprocessors in the STM32MP157 product line to allow users to develop applications easily using STM32 MPU OpenSTLinux Distribution software for the main processor and STM32CubeMP1 software for the coprocessor.
They include an ST-LINK embedded debug tool, LEDs, push-buttons, one Ethernet 1-Gbit/s connector, one USB Type-C®OTG connector, four USB Host Type-A connectors, one HDMI®transceiver, one stereo headset jack with analog microphone, and one microSD™ connector.
To expand the functionality of the STM32MP157D-DK1 and STM32MP157F-DK2 Discovery kits, two GPIO expansion connectors are also available for ARDUINO®and Raspberry Pi®shields.
Additionally, the STM32MP157F-DK2 Discovery kit features an LCD display with a touch panel, and Wi‑Fi®and Bluetooth®Low Energy capability. |
| Development Boards, Kits, Programmers | 1 | Active | The STM32MP157D-EV1 and STM32MP157F-EV1 Evaluation boards are the full-feature demonstration and development platforms for STMicroelectronics increased-frequency 800 MHz Arm®-based dual Cortex®-A7 32 bits and Cortex®-M4 32 bits MPUs in the STM32MP1 Series. They leverage the capabilities of STM32MP1 Series microprocessors to allow users develop applications using STM32 MPU OpenSTLinux Distribution software for the main processor and STM32CubeMP1 software for the co-processor.
They include an ST-LINK embedded debug tool, LEDs, push-buttons, one joystick, 1-Gbps Ethernet, CAN FD, one USB OTG Micro-AB connector, four USB Host Type-A connectors, LCD display with touch panel, camera, stereo headset jack with analog microphone input, four digital microphones, one SPDIF Rx/Tx, smartcard, microSD™ card, and eMMC, NOR and NAND Flash memories.
To expand the functionality of the STM32MP157D-EV1 and STM32MP157F-EV1 Evaluation boards, two GPIO expansion connectors are also available for motor control and Raspberry Pi®shields. |
STM32MP157FMPU with Arm Dual Cortex-A7 800 MHz, Arm Cortex-M4 real-time coprocessor, 3D GPU, TFT/MIPI DSI displays, FD-CAN, Secure boot and Cryptography | Microprocessors | 5 | Active | The STM32MP157C/F devices are based on the high-performance dual-core Arm®Cortex®-A7 32-bit RISC core operating at up to 800 MHz. The Cortex-A7 processor includes a 32-Kbyte L1 instruction cache for each CPU, a 32-Kbyte L1 data cache for each CPU and a 256-Kbyte level2 cache. The Cortex-A7 processor is a very energy-efficient application processor designed to provide rich performance in high-end wearables, and other low-power embedded and consumer applications. It provides up to 20% more single thread performance than the Cortex-A5 and provides similar performance than the Cortex-A9.
The Cortex-A7 incorporates all features of the high-performance Cortex-A15 and Cortex-A17 processors, including virtualization support in hardware, NEON™, and 128-bit AMBA®4 AXI bus interface.
The STM32MP157C/F devices also embed a Cortex®-M4 32-bit RISC core operating at up to 209 MHz frequency. Cortex-M4 core features a floating point unit (FPU) single precision which supports Arm®single-precision data-processing instructions and data types. The Cortex®-M4 supports a full set of DSP instructions and a memory protection unit (MPU) which enhances application security.
The STM32MP157C/F devices also embed a 3D graphic processing unit (Vivante®- OpenGL®ES 2.0) running at up to 533 MHz, with performances up to 26 Mtriangle/s, 133 Mpixel/s.
The STM32MP157C/F devices provide an external SDRAM interface supporting external memories up to 8-Gbit density (1 Gbyte), 16 or 32-bit LPDDR2/LPDDR3 or DDR3/DDR3L up to 533 MHz.
The STM32MP157C/F devices incorporate high-speed embedded memories with 708 Kbytes of Internal SRAM (including 256 Kbytes of AXI SYSRAM, 3 banks of 128 Kbytes each of AHB SRAM, 64 Kbytes of AHB SRAM in backup domain and 4 Kbytes of SRAM in backup domain), as well as an extensive range of enhanced I/Os and peripherals connected to APB buses, AHB buses, a 32-bit multi-AHB bus matrix and a 64-bit multi layer AXI interconnect supporting internal and external memories access.
All the devices offer two ADCs, two DACs, a low-power RTC, 12 general-purpose 16-bit timers, two PWM timers for motor control, five low-power timers, a true random number generator (RNG), and a cryptographic acceleration cell. The devices support six digital filters for external sigma delta modulators (DFSDM). They also feature standard and advanced communication interfaces. |
| Embedded MCU, DSP Evaluation Boards | 1 | Active | The STM32MP157D-DK1 and STM32MP157F-DK2 Discovery kits leverage the capabilities of the increased-frequency 800 MHz microprocessors in the STM32MP157 product line to allow users to develop applications easily using STM32 MPU OpenSTLinux Distribution software for the main processor and STM32CubeMP1 software for the coprocessor.
They include an ST-LINK embedded debug tool, LEDs, push-buttons, one Ethernet 1-Gbit/s connector, one USB Type-C®OTG connector, four USB Host Type-A connectors, one HDMI®transceiver, one stereo headset jack with analog microphone, and one microSD™ connector.
To expand the functionality of the STM32MP157D-DK1 and STM32MP157F-DK2 Discovery kits, two GPIO expansion connectors are also available for ARDUINO®and Raspberry Pi®shields.
Additionally, the STM32MP157F-DK2 Discovery kit features an LCD display with a touch panel, and Wi‑Fi®and Bluetooth®Low Energy capability. |
| Embedded | 2 | Active | |
STM32MP251AMPU with Arm Cortex-A35 @1.2GHz, Cortex-M33 @400MHz, 1xEthernet | Integrated Circuits (ICs) | 3 | Active | STM32MP25xA/D devices are based on the high-performance single or dual-core Arm® Cortex®-A35 64-bit RISC core operating at up to 1.5 GHz. The Cortex®‑A35 processor includes a 32-Kbyte L1 instruction cache for each CPU, a 32-Kbyte L1 data cache for each CPU, and a 512-Kbyte L2 cache. The Cortex®‑A35 processor uses a highly efficient 8-stage in-order pipeline that has been extensively optimized to provide full Armv8-A features while maximizing area and power efficiency.
STM32MP25xA/D devices also embed a Cortex®-M33 32-bit RISC core operating at up to 400 MHz frequency. The Cortex®-M33 core features a floating point unit (FPU) single precision which supports Arm® single-precision data-processing instructions, and data types. The Cortex®-M33 supports a full set of DSP instructions, TrustZone®, and a memory protection unit (MPU) which enhances application security.
The devices also embed a Cortex®-M0+ 32-bit RISC core operating at up to 200 MHz frequency (16 MHz when running from backup regulator). This processor is located in the SmartRun domain, and can be used to ensure very-low-power peripheral activity when all other processors and domains are stopped.
STM32MP25xA/D devices can also embed a 3D graphic processing unit (VeriSilicon®, OpenGL ES 3.1, Vulkan 1.3, OpenCL 3.0, OpenVX 1.3) running at up to 900 MHz, with performances up to 150 Mtriangle/s, 900 Mpixel/s.
The graphic processing unit can provide a neural processor unit (VeriSilicon®, TensorFlowLite, ONNX, Linux NN) running at up to 900 MHz.
STM32MP25xA/D devices provide an external SDRAM interface supporting external memories up to 32‑Gbit density (4 Gbytes), 16- or 32-bit DDR3L up to 1066 MHz, 16- or 32-bit LPDDR4 or DDR4 up to 1200 MHz.
The devices incorporate high-speed embedded memories: 808 Kbytes of internal SRAM (including 256-Kbyte AXI SYSRAM, 128-Kbyte AXI video SRAM (which can be used as general purpose), two banks of 128 Kbytes each of AHB SRAM, three banks of 8, 8, and 16 Kbytes of AHB SRAM in SmartRun domain, 128 Kbytes of AHB SRAM in backup domain, and 8 Kbytes of SRAM in backup domain), as well as an extensive range of enhanced I/Os and peripherals connected to APB buses, AHB buses, a 32-bit multi-AHB bus matrix, and a 128/64-bit multi-layer AXI interconnect supporting access to internal and external memories.
Each device offers three ADCs, a low-power secure RTC, 12 general-purpose 16-bit timers, 4 general-purpose 32‑bit timers, three PWM timers for motor control, five low-power timers, and a true random number generator (RNG)
STM32MP25xA/D devices offer a video encoder and a video decoder.
The devices support 8 multi-function digital filters (MDF), and one dedicated audio-digital filter with sound-activity detection (ADF).
The devices feature the following standard and advanced communication interfaces.
Standard peripherals
Advanced peripherals including
A comprehensive set of power-saving mode allows the design of low-power applications.
STM32MP25xA/D devices are proposed in various packages up to 436 balls with 0.5 mm to 0.8 mm pitch. The set of included peripherals can change with the selected device.
These features make STM32MP25xA/D devices suitable for a wide range of consumer, industrial, white goods and medical applications. |
STM32MP251CMPU with Arm Cortex-A35 @1.2GHz, Cortex-M33 @400MHz, 1xEthernet, Secure Boot, Cryptography, DRAM enc/dec, PKA | Microprocessors | 3 | Active | STM32MP25xC/F devices are based on the high-performance single or dual-core Arm® Cortex®-A35 64-bit RISC core operating at up to 1.5 GHz. The Cortex®‑A35 processor includes a 32-Kbyte L1 instruction cache for each CPU, a 32-Kbyte L1 data cache for each CPU, and a 512-Kbyte L2 cache. The Cortex®‑A35 processor uses a highly efficient 8-stage in-order pipeline that has been extensively optimized to provide full Armv8-A features while maximizing area and power efficiency.
STM32MP25xC/F devices also embed a Cortex®-M33 32-bit RISC core operating at up to 400 MHz frequency. The Cortex®-M33 core features a floating point unit (FPU) single precision which supports Arm® single-precision data-processing instructions, and data types. The Cortex®-M33 supports a full set of DSP instructions, TrustZone®, and a memory protection unit (MPU) which enhances application security.
The devices also embed a Cortex®-M0+ 32-bit RISC core operating at up to 200 MHz frequency (16 MHz when running from backup regulator). This processor is located in the SmartRun domain, and can be used to ensure very-low-power peripheral activity when all other processors and domains are stopped.
STM32MP25xC/F devices can also embed a 3D graphic processing unit (VeriSilicon®, OpenGL ES 3.1, Vulkan 1.3, OpenCL 3.0, OpenVX 1.3) running at up to 900 MHz, with performances up to 150 Mtriangle/s, 900 Mpixel/s.
The graphic processing unit can provide a neural processor unit (VeriSilicon®, TensorFlowLite, ONNX, Linux NN) running at up to 900 MHz.
STM32MP25xC/F devices provide an external SDRAM interface supporting external memories up to 32‑Gbit density (4 Gbytes), 16- or 32-bit DDR3L up to 1066 MHz, 16- or 32-bit LPDDR4 or DDR4 up to 1200 MHz. The SDRAM content can be encrypted with AES-128.
The devices incorporate high-speed embedded memories: 808 Kbytes of internal SRAM (including 256-Kbyte AXI SYSRAM, 128-Kbyte AXI video SRAM (which can be used as general purpose), two banks of 128 Kbytes each of AHB SRAM, three banks of 8, 8, and 16 Kbytes of AHB SRAM in SmartRun domain, 128 Kbytes of AHB SRAM in backup domain, and 8 Kbytes of SRAM in backup domain), as well as an extensive range of enhanced I/Os and peripherals connected to APB buses, AHB buses, a 32-bit multi-AHB bus matrix, and a 128/64-bit multi-layer AXI interconnect supporting access to internal and external memories.
Each device offers three ADCs, a low-power secure RTC, 12 general-purpose 16-bit timers, 4 general-purpose 32‑bit timers, three PWM timers for motor control, five low-power timers, and a true random number generator (RNG) , and cryptographic acceleration cells.
STM32MP25xC/F devices offer a video encoder and a video decoder.
The devices support 8 multi-function digital filters (MDF), and one dedicated audio-digital filter with sound-activity detection (ADF).
The devices feature the following standard and advanced communication interfaces.
Standard peripherals
Advanced peripherals including
A comprehensive set of power-saving mode allows the design of low-power applications.
STM32MP25xC/F devices are proposed in various packages up to 436 balls with 0.5 mm to 0.8 mm pitch. The set of included peripherals can change with the selected device.
These features make STM32MP25xC/F devices suitable for a wide range of consumer, industrial, white goods and medical applications. |
STM32MP251DMPU with Arm Cortex-A35 @1.5GHz, Cortex-M33 @400MHz, 1xEthernet | Microprocessors | 3 | Active | STM32MP25xA/D devices are based on the high-performance single or dual-core Arm® Cortex®-A35 64-bit RISC core operating at up to 1.5 GHz. The Cortex®‑A35 processor includes a 32-Kbyte L1 instruction cache for each CPU, a 32-Kbyte L1 data cache for each CPU, and a 512-Kbyte L2 cache. The Cortex®‑A35 processor uses a highly efficient 8-stage in-order pipeline that has been extensively optimized to provide full Armv8-A features while maximizing area and power efficiency.
STM32MP25xA/D devices also embed a Cortex®-M33 32-bit RISC core operating at up to 400 MHz frequency. The Cortex®-M33 core features a floating point unit (FPU) single precision which supports Arm® single-precision data-processing instructions, and data types. The Cortex®-M33 supports a full set of DSP instructions, TrustZone®, and a memory protection unit (MPU) which enhances application security.
The devices also embed a Cortex®-M0+ 32-bit RISC core operating at up to 200 MHz frequency (16 MHz when running from backup regulator). This processor is located in the SmartRun domain, and can be used to ensure very-low-power peripheral activity when all other processors and domains are stopped.
STM32MP25xA/D devices can also embed a 3D graphic processing unit (VeriSilicon®, OpenGL ES 3.1, Vulkan 1.3, OpenCL 3.0, OpenVX 1.3) running at up to 900 MHz, with performances up to 150 Mtriangle/s, 900 Mpixel/s.
The graphic processing unit can provide a neural processor unit (VeriSilicon®, TensorFlowLite, ONNX, Linux NN) running at up to 900 MHz.
STM32MP25xA/D devices provide an external SDRAM interface supporting external memories up to 32‑Gbit density (4 Gbytes), 16- or 32-bit DDR3L up to 1066 MHz, 16- or 32-bit LPDDR4 or DDR4 up to 1200 MHz.
The devices incorporate high-speed embedded memories: 808 Kbytes of internal SRAM (including 256-Kbyte AXI SYSRAM, 128-Kbyte AXI video SRAM (which can be used as general purpose), two banks of 128 Kbytes each of AHB SRAM, three banks of 8, 8, and 16 Kbytes of AHB SRAM in SmartRun domain, 128 Kbytes of AHB SRAM in backup domain, and 8 Kbytes of SRAM in backup domain), as well as an extensive range of enhanced I/Os and peripherals connected to APB buses, AHB buses, a 32-bit multi-AHB bus matrix, and a 128/64-bit multi-layer AXI interconnect supporting access to internal and external memories.
Each device offers three ADCs, a low-power secure RTC, 12 general-purpose 16-bit timers, 4 general-purpose 32‑bit timers, three PWM timers for motor control, five low-power timers, and a true random number generator (RNG)
STM32MP25xA/D devices offer a video encoder and a video decoder.
The devices support 8 multi-function digital filters (MDF), and one dedicated audio-digital filter with sound-activity detection (ADF).
The devices feature the following standard and advanced communication interfaces.
Standard peripherals
Advanced peripherals including
A comprehensive set of power-saving mode allows the design of low-power applications.
STM32MP25xA/D devices are proposed in various packages up to 436 balls with 0.5 mm to 0.8 mm pitch. The set of included peripherals can change with the selected device.
These features make STM32MP25xA/D devices suitable for a wide range of consumer, industrial, white goods and medical applications. |
