Renesas Electronics Corporation

The R8C/33M Group is supported only for customers who have already adopted these products. The RL78/G1F Group is recommended for new designs The R8C/33M Group of single-chip MCUs incorporates the R8C CPU core, employing sophisticated instructions for a high level of efficiency. With 1Mb of address space, and it is capable of executing instructions at high speed. In addition, the CPU core boasts a multiplier for high-speed operation processing. Power consumption is low, and the supported operating modes allow additional power control. These MCUs are designed to maximize EMI/EMS performance. Integration of many peripheral functions, including multifunction timer and serial interface, reduces the number of system components. The R8C/33M Group has data flash (1KB × 4 blocks) with the background operation (BGO) function.

The R8C/33T Group is supported only for customers who have already adopted these products. The RX130 Group is recommended for new designs. The R8C/33T Group of single-chip MCUs incorporates the R8C CPU core, employing sophisticated instructions for a high level of efficiency. With 1Mb of address space, and it is capable of executing instructions at high speed. In addition, the CPU core boasts a multiplier for high-speed operation processing. Power consumption is low, and the supported operating modes allow additional power control. These MCUs are designed to maximize EMI/EMS performance. Integration of many peripheral functions, including multifunction timer and serial interface, reduces the number of system components. The R8C/33T Group has data flash (1KB × 4 blocks) with the background operation (BGO) function.

The R8C/34C Group is supported only for customers who have already adopted these products. The RL78/G1F Group is recommended for new designs. The R8C/34C Group of single-chip MCUs incorporates the R8C CPU core, employing sophisticated instructions for a high level of efficiency. With 1Mb of address space, and it is capable of executing instructions at high speed. In addition, the CPU core boasts a multiplier for high-speed operation processing. Power consumption is low, and the supported operating modes allow additional power control. These MCUs are designed to maximize EMI/EMS performance. Integration of many peripheral functions, including multifunction timer and serial interface, reduces the number of system components. The R8C/34C Group has data flash (1KB × 4 blocks) with the background operation (BGO) function.

The R8C/34K Group is supported only for the customers who have already adopted these products. For new adoption, please consider other products such as RL78/G1C Group. The R8C/34E Group, R8C/34F Group, R8C/34G Group, and R8C/34H Group of single-chip MCUs incorporate the R8C/Tiny Series CPU core, employing sophisticated instructions for a high level of efficiency. With 1Mb of address space, and it is capable of executing instructions at high speed. In addition, the CPU core boasts a multiplier for high-speed operation processing. Power consumption is low, and the supported operating modes allow additional power control. These MCUs are designed to maximize EMI/EMS performance. Integration of many peripheral functions, including multifunction timer and serial interface, reduces the number of system components. The R8C/34E Group and R8C/34F Group have a single channel CAN module and are suitable for LAN systems in vehicles and for FA. The R8C/34G Group and the R8C/34H Group do not have CAN modules. The R8C/34E Group and the R8C/34G Group have data flash (1KB × 4 blocks) with the background operation (BGO) function.