Renesas Electronics Corporation

The R8C/35C Group is supported only for customers who have already adopted these products. The RL78/G14, RL78/G1F Groups are recommended for new designs. The R8C/35C Group of single-chip MCUs incorporates the R8C CPU core, employing sophisticated instructions for a high level of efficiency. With 1Mb of address space, and it is capable of executing instructions at high speed. In addition, the CPU core boasts a multiplier for high-speed operation processing. Power consumption is low, and the supported operating modes allow additional power control. These MCUs are designed to maximize EMI/EMS performance. Integration of many peripheral functions, including multifunction timer and serial interface, reduces the number of system components. The R8C/35C Group has data flash (1KB × 4 blocks) with the background operation (BGO) function.

The R8C/35M Group is supported only for customers who have already adopted these products. The RL78/G14, RL78/G1F Groups are recommended for new designs. The R8C/35M Group of single-chip MCUs incorporates the R8C CPU core, employing sophisticated instructions for a high level of efficiency. With 1Mb of address space, and it is capable of executing instructions at high speed. In addition, the CPU core boasts a multiplier for high-speed operation processing. Power consumption is low, and the supported operating modes allow additional power control. These MCUs are designed to maximize EMI/EMS performance. Integration of many peripheral functions, including multifunction timer and serial interface, reduces the number of system components. The R8C/35M Group has data flash (1KB × 4 blocks) with the background operation (BGO) function.

The R8C/36C Group is supported only for customers who have already adopted these products. The RL78/G14, RL78/G1F Groups are recommended for new designs. The R8C/36C Group of single-chip MCUs incorporates the R8C CPU core, employing sophisticated instructions for a high level of efficiency. With 1Mb of address space, and it is capable of executing instructions at high speed. In addition, the CPU core boasts a multiplier for high-speed operation processing. Power consumption is low, and the supported operating modes allow additional power control. These MCUs are designed to maximize EMI/EMS performance. Integration of many peripheral functions, including multifunction timer and serial interface, reduces the number of system components. The R8C/36C Group has data flash (1KB × 4 blocks) with the background operation (BGO) function.

The R8C/38C Group is supported only for customers who have already adopted these products. The RL78/G14 Group is recommended for new designs. The R8C/38C Group of single-chip MCUs incorporates the R8C CPU core, employing sophisticated instructions for a high level of efficiency. With 1Mb of address space, and it is capable of executing instructions at high speed. In addition, the CPU core boasts a multiplier for high-speed operation processing. Power consumption is low, and the supported operating modes allow additional power control. These MCUs are designed to maximize EMI/EMS performance. Integration of many peripheral functions, including multifunction timer and serial interface, reduces the number of system components. The R8C/38C Group has data flash (1KB × 4 blocks) with the background operation (BGO) function.

The R8C/3GC Group is supported only for customers who have already adopted these products. The RL78/G1F, RL78/G13 Groups are recommended for new designs. The R8C/3GC Group of single-chip MCUs incorporates the R8C CPU core, employing sophisticated instructions for a high level of efficiency. With 1Mb of address space, and it is capable of executing instructions at high speed. In addition, the CPU core boasts a multiplier for high-speed operation processing. Power consumption is low, and the supported operating modes allow additional power control. These MCUs are designed to maximize EMI/EMS performance. Integration of many peripheral functions, including multifunction timer and serial interface, reduces the number of system components. The R8C/3GC Group has data flash (1KB × 4 blocks) with the background operation (BGO) function.

The R8C/3GC Group is supported only for customers who have already adopted these products. The RL78/G1F, RL78/G13 Groups are recommended for new designs. The R8C/3GC Group of single-chip MCUs incorporates the R8C CPU core, employing sophisticated instructions for a high level of efficiency. With 1Mb of address space, and it is capable of executing instructions at high speed. In addition, the CPU core boasts a multiplier for high-speed operation processing. Power consumption is low, and the supported operating modes allow additional power control. These MCUs are designed to maximize EMI/EMS performance. Integration of many peripheral functions, including multifunction timer and serial interface, reduces the number of system components. The R8C/3GC Group has data flash (1KB × 4 blocks) with the background operation (BGO) function.

The R8C/3JT Group is supported only for customers who have already adopted these products. The RX130 Group is recommended for new designs. The R8C/3JT Group of single-chip MCUs incorporates the R8C CPU core, employing sophisticated instructions for a high level of efficiency. With 1Mb of address space, and it is capable of executing instructions at high speed. In addition, the CPU core boasts a multiplier for high-speed operation processing. Power consumption is low, and the supported operating modes allow additional power control. These MCUs are designed to maximize EMI/EMS performance. Integration of many peripheral functions, including multifunction timer and serial interface, reduces the number of system components. The R8C/3JT Group has data flash (1KB × 4 blocks) with the background operation (BGO) function.

The R8C/3JT Group is supported only for customers who have already adopted these products. The RX130 Group is recommended for new designs. The R8C/3JT Group of single-chip MCUs incorporates the R8C CPU core, employing sophisticated instructions for a high level of efficiency. With 1Mb of address space, and it is capable of executing instructions at high speed. In addition, the CPU core boasts a multiplier for high-speed operation processing. Power consumption is low, and the supported operating modes allow additional power control. These MCUs are designed to maximize EMI/EMS performance. Integration of many peripheral functions, including multifunction timer and serial interface, reduces the number of system components. The R8C/3JT Group has data flash (1KB × 4 blocks) with the background operation (BGO) function.

The R8C/3MU, R8C/3MK Group of single-chip MCUs incorporates the R8C CPU core, employing sophisticated instructions for a high level of efficiency. The R8C/3MQ Group single-chip MCU functions as a low-power-consumption transceiver which supports 2. 4 GHz compliant to IEEE802. 15. 4 standard and incorporates the R8C CPU core, employing sophisticated instructions for a high level of efficiency. With 1Mb of address space, and it is capable of executing instructions at high speed. In addition, the CPU core boasts a multiplier for high-speed operation processing. Power consumption is low, and the supported operating modes allow additional power control. Integration of many peripheral functions, including multifunction timer and serial interface, reduces the number of system components. The R8C/3MQ Group has data flash (1KB × 4 blocks) with the background operation (BGO) function.