Renesas Electronics Corporation

The R8C/27 Group is supported only for customers who have already adopted these products. The RL78/G14 Group is recommended for new designs. These MCUs are fabricated using a high-performance silicon gate CMOS process, embedding the R8C CPU core, and are packaged in a 32-pin molded-plastic LQFP. It implements sophisticated instructions for a high level of instruction efficiency. With 1Mb of address space, they are capable of executing instructions at high speed. Furthermore, the R8C/27 Group has on-chip data flash (1KB × 2 blocks). The difference between the R8C/26 Group and R8C/27 Group is only the presence or absence of data flash. Their peripheral functions are the same.

The R8C/28 Group is supported only for customers who have already adopted these products. The RL78/G14 Group is recommended for new designs. These MCUs are fabricated using a high-performance silicon gate CMOS process, embedding the R8C CPU core, and are packaged in a 32-pin molded-plastic LQFP. It implements sophisticated instructions for a high level of instruction efficiency. With 1Mb of address space, they are capable of executing instructions at high speed. Furthermore, the R8C/27 Group has on-chip data flash (1KB × 2 blocks). The difference between the R8C/26 Group and R8C/27 Group is only the presence or absence of data flash. Their peripheral functions are the same.

The R8C/29 Group is supported only for customers who have already adopted these products. The RL78/G14 Group is recommended for new designs. These MCUs are fabricated using a high-performance silicon gate CMOS process, embedding the R8C CPU core, and are packaged in a 20-pin molded-plastic LSSOP. It implements sophisticated instructions for a high level of instruction efficiency. With 1Mb of address space, they are capable of executing instructions at high speed. Furthermore, the R8C/29 Group has on-chip data flash (1KB × 2 blocks). The difference between the R8C/28 Group and R8C/29 Group is only the presence or absence of data flash. Their peripheral functions are the same.

The R8C/2B Group is supported only for customers who have already adopted these products. The RL78/G14 Group is recommended for new designs. The R8C/2A Group and R8C/2B Group of single-chip MCUs incorporates the R8C/Tiny Series CPU core, employing sophisticated instructions for a high level of efficiency. With 1Mb of address space, and it is capable of executing instructions at high speed. In addition, the CPU core boasts a multiplier for high-speed operation processing. Power consumption is low, and the supported operating modes allow additional power control. These MCUs also use an anti-noise configuration to reduce emissions of electromagnetic noise and are designed to withstand EMI. Integration of many peripheral functions, including multifunction timer and serial interface, reduces the number of system components. Furthermore, the R8C/2B Group has on-chip data flash (1KB × 2 blocks). The difference between the R8C/2A Group and R8C/2B Group is only the presence or absence of data flash. Their peripheral functions are the same.