Microchip Technology

The SX family of FPGAs features a sea-of-modules architecture that greatly simplify design time, enable dramatic reductions in design costs and power consumption, and further decrease time to market for performance-intensive applications Key Features • 320 MHz Internal Performance • 3.3 V and 5.0 V Operation with 5.0 V Input Tolerance • Deterministic, User-Controllable Timing • Secure Programming Technology Prevents Reverse Engineering and Design Theft

SX-A devices can be used to generate system-wide savings by integrating multiple functions into a low cost, single-chip solution. Providing a combination of performance, security, and low power, SX-A decreases the premium for performance while providing a solution highly secure from reverse engineering Key Features • System performance of 250 MHz • Hot-Swap Compliant I/Os • 2.5 V, 3.3 V, and 5 V Mixed-Voltage Operation with 5 V Input Tolerance and 5 V Drive Strength • Configurable I/O Support for 3.3 V / 5 V PCI, 5 V TTL, 3.3 V LVTTL, 2.5 V LVCMOS2 • 66 MHz PCI Compliant

The AAC242/43 are PWM controllers designed as upgrades on the workhorse UC1/2/3842 and UC1/2/3843 family of Current Mode PWM Controllers, available from various sources. The AAC242/43 are intended for Offline or DC/DC power converter applications. Features in common with the x842/x843 design include current mode control, pulse-pulse current limiting, undervoltage lockout with hysteresis and an on-board voltage reference. In addition, as with the x842/x843 controllers, the AAC242 is differentiated from the AAC243 by its undervoltage lockout thresholds. The AAC242 has turnon/turn-off thresholds of 16V and 10V respectively, while the AAC243 thresholds are 8.4V and 7.6V respectively. The AAC243 is targeted for battery applications, based on their lower undervoltage and hysteresis levels. The lower V-ILimit options of the AAC242/43 of 0.25V, as compared to the 1.0V for the AAC142/43, allow for lower current sense measurements. Other features designed into this family of Current Mode Controllers are intended to enhance their functionality and range of use. The maximum Start-Up current is substantially lower than the x842/x843. Output drive rise and fall times of 50ns for the AAC242/43 compare to 150ns maximum rise and fall times for the x842/x843. Other unique features of the AAC242/43 include an integrated soft-start function tied to the clock of the internal oscillator (approximately 330 cycles), leading edge current blanking of 100ns and a more robust, higher current MOS output drive stage capable of driving much higher source and sink currents. The enhancements in drive capability, as well as rise and fall times, enable the AAC242/43 to operate up to 1MHz vs. the 500kHz maximum typically ascribed for the x842/843.

"Electret Condenser Microphone (ECM) Pre-Amplifier w/Programmable HPF The AAP661X ECM Pre Amplifiers were designed for the recent exclusive use of Plantronics, Inc. of Santa Cruz, CA for high end audio headset microphone applications. The AAP661X is now available for general sale to the audio microphone marketplace. The performance of this Pre-Amplifier is such that it enables design of enhanced end system products, due to its various gain options, ultralow noise and other high performance features. The AAP661X ECM Pre-Amplifier provides a number of performance advantages over prior ECM Pre-Amplifier products. Key features include ultra low input capacitance (0.35pF typical) and quiescent current (250?A typical), with ultra low equivalent input noise (1.9 to 2.5 ?V RMS, A-Weighted, with the microphone capacitor short circuited, gain version dependent). Additionally, the Pre-Amplifier sports a programmable high pass filter with operation down to 1.6V. Other key features include THD performance below 0.5% maximum, output impedance of 25? typical, with exceptionally high tolerance to RF interference and ESD tolerance (8kV). The AAP661X is offered with two gain options, 16dB and 19dB. Packaging is bumped chip scale SMD configuration, with a size of 930?m x 580?m and an overall thickness of 350?m (including solder bumps). Optimum for 3mm microphones, the die is RoHS compliant, with lead free solder pads of 118?m diameter. Packing styles available are 2" x 2" Waffle Pack or Tape and Reel."