Microchip Technology

This Microchip Powermite® surface mount low noise Zener package series provides a higher power handling capability that are also RoHS compliant. In addition to its size advantages, Powermite® package features include a full-metallic bottom that eliminates the possibility of solder flux entrapment during assembly, and a unique locking tab acts as an efficient heat path from die to mounting plane for external heat sinking with very low thermal resistance junction to case (bottom). Its innovative design makes this device ideal for use with automatic insertion equipment.

This Microchip Powermite® surface mount low noise Zener package series provides a higher power handling capability that are also RoHS compliant. In addition to its size advantages, Powermite® package features include a full-metallic bottom that eliminates the possibility of solder flux entrapment during assembly, and a unique locking tab acts as an efficient heat path from die to mounting plane for external heat sinking with very low thermal resistance junction to case (bottom). Its innovative design makes this device ideal for use with automatic insertion equipment.

This Microchip Powermite® surface mount low noise Zener package series provides a higher power handling capability that are also RoHS compliant. In addition to its size advantages, Powermite® package features include a full-metallic bottom that eliminates the possibility of solder flux entrapment during assembly, and a unique locking tab acts as an efficient heat path from die to mounting plane for external heat sinking with very low thermal resistance junction to case (bottom). Its innovative design makes this device ideal for use with automatic insertion equipment.

This Microchip Powermite® surface mount low noise Zener package series provides a higher power handling capability that are also RoHS compliant. In addition to its size advantages, Powermite® package features include a full-metallic bottom that eliminates the possibility of solder flux entrapment during assembly, and a unique locking tab acts as an efficient heat path from die to mounting plane for external heat sinking with very low thermal resistance junction to case (bottom). Its innovative design makes this device ideal for use with automatic insertion equipment.

This Microchip Powermite® surface mount low noise Zener package series provides a higher power handling capability that are also RoHS compliant. In addition to its size advantages, Powermite® package features include a full-metallic bottom that eliminates the possibility of solder flux entrapment during assembly, and a unique locking tab acts as an efficient heat path from die to mounting plane for external heat sinking with very low thermal resistance junction to case (bottom). Its innovative design makes this device ideal for use with automatic insertion equipment.

This Microchip Powermite® surface mount low noise Zener package series provides a higher power handling capability that are also RoHS compliant. In addition to its size advantages, Powermite® package features include a full-metallic bottom that eliminates the possibility of solder flux entrapment during assembly, and a unique locking tab acts as an efficient heat path from die to mounting plane for external heat sinking with very low thermal resistance junction to case (bottom). Its innovative design makes this device ideal for use with automatic insertion equipment.

This Microchip Powermite® surface mount low noise Zener package series provides a higher power handling capability that are also RoHS compliant. In addition to its size advantages, Powermite® package features include a full-metallic bottom that eliminates the possibility of solder flux entrapment during assembly, and a unique locking tab acts as an efficient heat path from die to mounting plane for external heat sinking with very low thermal resistance junction to case (bottom). Its innovative design makes this device ideal for use with automatic insertion equipment.

This Microchip Powermite® surface mount low noise Zener package series provides a higher power handling capability that are also RoHS compliant. In addition to its size advantages, Powermite® package features include a full-metallic bottom that eliminates the possibility of solder flux entrapment during assembly, and a unique locking tab acts as an efficient heat path from die to mounting plane for external heat sinking with very low thermal resistance junction to case (bottom). Its innovative design makes this device ideal for use with automatic insertion equipment.

This surface mountable 3.0 W Zener diode series in the JEDEC DO-216 package is similar in electrical features to the JEDEC registered 1N5913B thru 1N5956B axial-leaded package for 3.3 to 200 V- It is an ideal selection for applications requiring low profile and high-density mounting that are also RoHS Compliant - When properly heat sunk, these Zener diodes provide power-handling capabilities only found in larger packages - In addition to its size advantages, Powermite® package features include a full metallic bottom that eliminates the possibility of solder flux entrapment during assembly, and a unique locking tab acts as an integral heat sink - Its innovative design makes this device ideal for use with automatic insertion equipment.

This surface mountable 3.0 W Zener diode series in the JEDEC DO-216 package is similar in electrical features to the JEDEC registered 1N5913B thru 1N5956B axial-leaded package for 3.3 to 200 V- It is an ideal selection for applications requiring low profile and high-density mounting that are also RoHS Compliant - When properly heat sunk, these Zener diodes provide power-handling capabilities only found in larger packages - In addition to its size advantages, Powermite® package features include a full metallic bottom that eliminates the possibility of solder flux entrapment during assembly, and a unique locking tab acts as an integral heat sink - Its innovative design makes this device ideal for use with automatic insertion equipment.