LITTELFUSE

The RoHS compliant 155 Series OMNI-BLOK® offers a solution for efficient installation and easy replacement of miniature Nano2® surface mount fuses. Offered bulk but also in a tape and reel package, this block can be installed on a PC board as an efficient single step. Fuse replacement can be accomplished without exposing the PC board to the detrimental effects of solder heat.

Littelfuse 157 series offer a solution for automated installation and replacement of miniature Nano2® surface mount fuses. Both fuse and clip combinations enable automated placement within PC Board assemblies, with the added benefits of quick and easy fuse replacement when necessary, without the risks of circuit board damage typically associated with re-soldering surface mount fuses.

Littelfuse 157 series offer a solution for automated installation and replacement of miniature Nano2® surface mount fuses. Both fuse and clip combinations enable automated placement within PC Board assemblies, with the added benefits of quick and easy fuse replacement when necessary, without the risks of circuit board damage typically associated with re-soldering surface mount fuses.

Littelfuse 157 series offer a solution for automated installation and replacement of miniature Nano2® surface mount fuses. Both fuse and clip combinations enable automated placement within PC Board assemblies, with the added benefits of quick and easy fuse replacement when necessary, without the risks of circuit board damage typically associated with re-soldering surface mount fuses.

Littelfuse 157 series offer a solution for automated installation and replacement of miniature Nano2® surface mount fuses. Both fuse and clip combinations enable automated placement within PC Board assemblies, with the added benefits of quick and easy fuse replacement when necessary, without the risks of circuit board damage typically associated with re-soldering surface mount fuses.

The 157T Series Fuse/Clip assembly is a small, square, time lag, surface mount fuse that is assembled in surface mountable fuse clips. The unique time delay feature of this fuse design helps solve the problem of nuisance "opening" by accommodating inrush currents that normally cause a fast acting fuse to open. The fuse clip and pre-installed fuse combination can be automatically placed in PC Board in one efficient manufacturing operation. It permits quick and easy replacement of fuses without performing desoldering process, even in the field and without exposing the PC Board to detrimental effects of rework solder heat.

The 157T Series Fuse/Clip assembly is a small, square, time lag, surface mount fuse that is assembled in surface mountable fuse clips. The unique time delay feature of this fuse design helps solve the problem of nuisance "opening" by accommodating inrush currents that normally cause a fast acting fuse to open. The fuse clip and pre-installed fuse combination can be automatically placed in PC Board in one efficient manufacturing operation. It permits quick and easy replacement of fuses without performing desoldering process, even in the field and without exposing the PC Board to detrimental effects of rework solder heat.

Littelfuse 157 series offer a solution for automated installation and replacement of miniature Nano2® surface mount fuses. Both fuse and clip combinations enable automated placement within PC Board assemblies, with the added benefits of quick and easy fuse replacement when necessary, without the risks of circuit board damage typically associated with re-soldering surface mount fuses.

The 157T Series Fuse/Clip assembly is a small, square, time lag, surface mount fuse that is assembled in surface mountable fuse clips. The unique time delay feature of this fuse design helps solve the problem of nuisance "opening" by accommodating inrush currents that normally cause a fast acting fuse to open. The fuse clip and pre-installed fuse combination can be automatically placed in PC Board in one efficient manufacturing operation. It permits quick and easy replacement of fuses without performing desoldering process, even in the field and without exposing the PC Board to detrimental effects of rework solder heat.