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Leader Tech Inc.

Leader Tech Inc. is a world-leading innovator in EMI/RFI shielding and thermal interface solutions, manufacturing 90% of products in Florida for aerospace, medical, telecom, and industrial applications.

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Leader Tech Inc., a HEICO company, is a world-leading innovator and manufacturer of EMI/RFI shielding products for circuit boards, electronic enclosures, and interconnect cables. Operating from their Global EMI Shielding Technology Center in Tampa, Florida, Leader Tech serves a diverse commercial and military customer base with both standard and custom shielding solutions.

Leader Tech's comprehensive product portfolio includes:

  • Standard and custom circuit board shields
  • BeCu (Beryllium Copper) gaskets
  • Conductive elastomers
  • Advanced RF absorbers (500 MHz to 80 GHz)
  • EMI/RFI vent panels
  • Thermal gap fillers and interface materials
  • TechMESH shielding products

With 90% of all products manufactured in Florida, Leader Tech delivers American-made quality for demanding aerospace, medical, telecommunications, and industrial applications. Their absorbing products attenuate microwave energy across a wide frequency range, while thermal gap fillers conform to surface irregularities to efficiently conduct heat away from sensitive components.

Frequently Asked Questions

What EMI shielding products does Leader Tech manufacture?
Leader Tech manufactures circuit board shields, BeCu gaskets, conductive elastomers, RF absorbers, EMI/RFI vent panels, and their proprietary TechMESH shielding products.
Where are Leader Tech products manufactured?
90% of Leader Tech products are manufactured at their Global EMI Shielding Technology Center in Tampa, Florida, USA.
What frequency range do Leader Tech RF absorbers cover?
Leader Tech's absorbing products are designed to attenuate microwave energy from 500 MHz to 80 GHz.
Does Leader Tech offer thermal management solutions?
Yes, Leader Tech provides thermal gap fillers that conform to surface gaps and irregularities to fill air gaps and efficiently conduct heat away from components.