Beta
Product families from Hologram, Inc.
| Series | Category | Parts | Status | Description |
|---|---|---|---|---|
Parts that are not part of a series
© Zenode. All rights reserved.
Parts from Hologram, Inc. that are not part of a series
| Part Information | Pricing (lowest) | Format | Network Technology | Size / Dimension Length | Size / Dimension Height | Size / Dimension Width | Operating Temperature (Max) | Operating Temperature (Min) |
|---|---|---|---|---|---|---|---|---|
 Hologram, Inc. EUICC TRIPLE CUT SIM | Sign in to see pricing | 2FF, Mini | 2G | 5 mm | 0.75 mm | 6 mm | 85 °C | -25 °C |
Hologram, Inc. EUICC MFF2 SIM WITH GLOBAL SIM P | Sign in to see pricing | ESIM, MFF2 | 2G | 5 mm | 0.75 mm | 6 mm | 85 °C | -25 °C |
 Hologram, Inc. GLOBAL IOT SIM 2FF/3FF/4FF | Sign in to see pricing | 2FF (Mini), 3FF (Micro), 4FF (Nano) | 2G, 3G, 4G LTE IOT | 5 mm | 0.82 mm | 6 mm | — | — |
 Hologram, Inc. GLOBAL IOT EMBEDDED SIM CHIP | Sign in to see pricing | ESIM, MFF2 | 2G, 3G, 4G LTE IOT | 5 mm | 0.82 mm | 6 mm | — | — |