Zenode.ai Logo
Beta
TPSM63606

TPSM63606 Series

High-density, 36-V input, 1-V to 16-V output, 6-A power module in 5-mm x 5.5-mm enhanced HotRod™ QFN

Manufacturer: Texas Instruments

Catalog

High-density, 36-V input, 1-V to 16-V output, 6-A power module in 5-mm x 5.5-mm enhanced HotRod™ QFN

PartControl FeaturesMounting TypeTypeFeaturesOperating Temperature [Max]Operating Temperature [Min]Supplier Device PackageSupplier Device Package [y]Supplier Device Package [x]Voltage - Output 1 [Max]Voltage - Output 1 [Min]EfficiencyNumber of OutputsVoltage - Input (Min) [Min]Package / CaseSize / Dimension [y]Size / Dimension [x]Size / Dimension [z]Size / Dimension [z]Size / Dimension [y]Size / Dimension [x]ApplicationsCurrent - Output (Max) [Max]Voltage - Input (Max) [Max]
B3QFN (RDL)
Texas Instruments
Active High
Enable
Surface Mount
Non-Isolated PoL Module
Adjustable Output
Remote On/Off
Remote Sense
125 °C
-40 °C
20-B3QFN
5.5
5
16 V
1 V
95.6 %
1
3 V
20-PowerBFQFN Module
0.2 "
0.22 in
4.1 mm
0.16 in
5 mm
5.5 mm
ITE (Commercial)
6 A
36 V
TPSM63606RDLR
Texas Instruments
Active High
Enable
Surface Mount
Non-Isolated PoL Module
Adjustable Output
Remote On/Off
Remote Sense
125 °C
-40 °C
20-B3QFN
5.5
5
16 V
1 V
91.3 %
1
3 V
20-PowerBFQFN Module
0.2 "
0.22 in
4.1 mm
0.16 in
5 mm
5.5 mm
ITE (Commercial)
6 A
36 V

Key Features

Functional Safety-CapableDocumentation available to aid functional safety system designVersatile 36-VIN, 6-AOUTsynchronous buck moduleIntegrated MOSFETs, inductor, and controllerAdjustable output voltage from 1 V to 16 V5.0-mm × 5.5-mm × 4-mm overmolded package–40°C to 125°C junction temperature rangeFrequency adjustable from 200 kHz to 2.2 MHzNegative output voltage capabilityUltra-high efficiency across the full load range95%+ peak efficiencyExternal bias option for improved efficiencyShutdown quiescent current of 0.6 µA (typical)Ultra-low conducted and radiated EMI signaturesLow-noise package with dual input paths and integrated capacitors reduces switch ringingSpread-spectrum modulation (S suffix)Resistor-adjustable switch-node slew rateMeets CISPR 11 and 32 class B emissionsSuitable for scalable power suppliesPin compatible with theTPSM63604(36 V, 4 A)Inherent protection features for robust designPrecision enable input and open-drain PGOOD indicator for sequencing, control, and VINUVLOOvercurrent and thermal shutdown protectionsCreate a custom design using the TPSM63606 with theWEBENCH Power DesignerFunctional Safety-CapableDocumentation available to aid functional safety system designVersatile 36-VIN, 6-AOUTsynchronous buck moduleIntegrated MOSFETs, inductor, and controllerAdjustable output voltage from 1 V to 16 V5.0-mm × 5.5-mm × 4-mm overmolded package–40°C to 125°C junction temperature rangeFrequency adjustable from 200 kHz to 2.2 MHzNegative output voltage capabilityUltra-high efficiency across the full load range95%+ peak efficiencyExternal bias option for improved efficiencyShutdown quiescent current of 0.6 µA (typical)Ultra-low conducted and radiated EMI signaturesLow-noise package with dual input paths and integrated capacitors reduces switch ringingSpread-spectrum modulation (S suffix)Resistor-adjustable switch-node slew rateMeets CISPR 11 and 32 class B emissionsSuitable for scalable power suppliesPin compatible with theTPSM63604(36 V, 4 A)Inherent protection features for robust designPrecision enable input and open-drain PGOOD indicator for sequencing, control, and VINUVLOOvercurrent and thermal shutdown protectionsCreate a custom design using the TPSM63606 with theWEBENCH Power Designer

Description

AI
Deriving from a family of synchronous buck modules, the TPSM63606 is a highly integrated 36-V, 6-A DC/DC solution that combines power MOSFETs, a shielded inductor, and passives in an Enhanced HotRod™ QFN package. The module has VIN and VOUT pins located at the corners of the package for optimized input and output capacitor placement. Four larger thermal pads beneath the module enable a simple layout and easy handling in manufacturing. With an output voltage from 1 V to 16 V, the TPSM63606 is designed to quickly and easily implement a low-EMI design in a small PCB footprint. The total solution requires as few as four external components and eliminates the magnetics and compensation part selection from the design process. Although designed for small size and simplicity in space-constrained applications, the TPSM63606 module offers many features for robust performance: precision enable with hysteresis for adjustable input-voltage UVLO, resistor-programmable switch node slew rate and spread spectrum option for improved EMI, integrated VCC, bootstrap, and input capacitors for increased reliability and higher density, constant switching frequency over the full load current range, and a PGOOD indicator for sequencing, fault protection, and output voltage monitoring. Deriving from a family of synchronous buck modules, the TPSM63606 is a highly integrated 36-V, 6-A DC/DC solution that combines power MOSFETs, a shielded inductor, and passives in an Enhanced HotRod™ QFN package. The module has VIN and VOUT pins located at the corners of the package for optimized input and output capacitor placement. Four larger thermal pads beneath the module enable a simple layout and easy handling in manufacturing. With an output voltage from 1 V to 16 V, the TPSM63606 is designed to quickly and easily implement a low-EMI design in a small PCB footprint. The total solution requires as few as four external components and eliminates the magnetics and compensation part selection from the design process. Although designed for small size and simplicity in space-constrained applications, the TPSM63606 module offers many features for robust performance: precision enable with hysteresis for adjustable input-voltage UVLO, resistor-programmable switch node slew rate and spread spectrum option for improved EMI, integrated VCC, bootstrap, and input capacitors for increased reliability and higher density, constant switching frequency over the full load current range, and a PGOOD indicator for sequencing, fault protection, and output voltage monitoring.