W66CM2 Series
Manufacturer: Winbond Electronics
IC DRAM 4GBIT LVSTL 11 200WFBGA
| Part | Memory Interface | Memory Type | Voltage - Supply [Min] | Voltage - Supply [Max] | Supplier Device Package | Clock Frequency | Technology | Operating Temperature [Min] | Operating Temperature [Max] | Mounting Type | Write Cycle Time - Word, Page | Memory Size | Memory Format | Memory Organization | Access Time | Package / Case |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
Winbond Electronics | LVSTL_11 | Volatile | 1.06 V 1.7 V | 1.17 V 1.95 V | 200-WFBGA (10x14.5) | 2.133 GHz | SDRAM - Mobile LPDDR4X | -40 °C | 105 °C | Surface Mount | 18 ns | 512 kB | DRAM | 128 M | 3.5 ns | 200-WFBGA |
Winbond Electronics | LVSTL_11 | Volatile | 1.06 V 1.7 V | 1.17 V 1.95 V | 200-WFBGA (10x14.5) | 1866 MHz | SDRAM - Mobile LPDDR4X | -40 °C | 95 °C | Surface Mount | 18 ns | 512 kB | DRAM | 256 M | 200-WFBGA | |
Winbond Electronics | LVSTL_11 | Volatile | 1.06 V 1.7 V | 1.17 V 1.95 V | 200-WFBGA (10x14.5) | 1866 MHz | SDRAM - Mobile LPDDR4X | -40 °C | 105 °C | Surface Mount | 18 ns | 512 kB | DRAM | 128 M | 3.5 ns | 200-WFBGA |
Winbond Electronics | LVSTL_11 | Volatile | 1.06 V 1.7 V | 1.17 V 1.95 V | 200-WFBGA (10x14.5) | 1600 MHz | SDRAM - Mobile LPDDR4X | -40 °C | 105 °C | Surface Mount | 18 ns | 512 kB | DRAM | 128 M | 3.5 ns | 200-WFBGA |