208381 Series
Manufacturer: Molex
PICO-CLASP1.0 SRVTETP .76GLHNAT
| Part | Current Rating (Amps) | Insulation Material | Voltage Rating | Insulation Color | Features | Contact Shape | Pitch - Mating | Pitch - Mating | Style | Contact Finish - Post | Contact Finish - Mating | Termination | Material Flammability Rating | Number of Positions Loaded | Connector Type | Contact Finish Thickness - Mating | Contact Finish Thickness - Mating | Number of Positions | Contact Material | Fastening Type | Operating Temperature [Min] | Operating Temperature [Max] | Mounting Type | Number of Rows | Insulation Height | Insulation Height [z] | Shrouding | Contact Type | Contact Finish Thickness - Post | Contact Finish Thickness - Post | Current Rating (Amps) |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
Molex | Varies by Wire Gauge | Glass Filled Nylon Polyamide (PA) | 100 VAC | Natural | Pick and Place Solder Retention | Rectangular | 0.039 in | 1 mm | Board to Cable/Wire | Gold | Gold | Solder | UL94 V-0 | All | Header | 30 Áin | 0.76 Ám | 2 | Phosphor Bronze | Friction Lock | -40 °C | 105 ░C | Surface Mount | 1 | 5.4 mm | 0.213 in | Shrouded - 4 Wall | Male Pin | 30 µin | 0.76 µm | |
Molex | Glass Filled Nylon Polyamide (PA) | 100 VAC | Natural | Pick and Place | Rectangular | 0.039 in | 1 mm | Board to Cable/Wire | Gold | Gold | Solder | UL94 V-0 | All | Header | 3.94 µin | 0.1 µm | 2 | Phosphor Bronze | Friction Lock | -40 °C | 105 ░C | Surface Mount | 1 | 5.4 mm | 0.213 in | Shrouded - 4 Wall | Male Pin | 2 A | |||
Molex | Varies by Wire Gauge | Glass Filled Nylon Polyamide (PA) | 100 VAC | Black | Solder Retention | Rectangular | 0.039 in | 1 mm | Board to Cable/Wire | Tin | Solder | UL94 V-0 | All | Header | 39.4 µin | 1 µm | 2 | Phosphor Bronze | Detent Lock | -40 °C | 105 ░C | Surface Mount | 1 | 5.4 mm | 0.213 in | Shrouded - 4 Wall | Male Pin | 39.4 çin | 1 çm | ||
Molex | Varies by Wire Gauge | Glass Filled Nylon Polyamide (PA) | 100 VAC | Natural | Pick and Place Solder Retention | Rectangular | 0.039 in | 1 mm | Board to Cable/Wire | Gold | Gold | Solder | UL94 V-0 | All | Header | 30 Áin | 0.76 Ám | Phosphor Bronze | Friction Lock | -40 °C | 105 ░C | Surface Mount | 1 | 5.4 mm | 0.213 in | Shrouded - 4 Wall | Male Pin | 30 µin | 0.76 µm | ||
Molex | Varies by Wire Gauge | Glass Filled Nylon Polyamide (PA) | 100 VAC | Natural | Pick and Place Solder Retention | Rectangular | 0.039 in | 1 mm | Board to Cable/Wire | Gold | Gold | Solder | UL94 V-0 | All | Header | 15 µin | 0.38 µm | 2 | Phosphor Bronze | Friction Lock | -40 °C | 105 ░C | Surface Mount | 1 | 5.4 mm | 0.213 in | Shrouded - 4 Wall | Male Pin | 15 µin | 0.38 µm | |
Molex | Varies by Wire Gauge | Glass Filled Nylon Polyamide (PA) | 100 VAC | Natural | Pick and Place Solder Retention | Rectangular | 0.039 in | 1 mm | Board to Cable/Wire | Gold | Gold | Solder | UL94 V-0 | All | Header | 3.94 µin | 0.1 µm | Phosphor Bronze | Friction Lock | -40 °C | 105 ░C | Surface Mount | 1 | 5.4 mm | 0.213 in | Shrouded - 4 Wall | Male Pin | 3.94 Áin | 0.1 Ám |