GD25Q64 Series
Manufacturer: GigaDevice Semiconductor (HK) Limited
IC FLASH 64MBIT SPI/QUAD 8USON
| Part | Operating Temperature [Max] | Operating Temperature [Min] | Clock Frequency | Supplier Device Package | Memory Interface | Voltage - Supply [Max] | Voltage - Supply [Min] | Memory Organization | Access Time | Memory Size | Memory Type | Mounting Type | Technology | Memory Format | Write Cycle Time - Word, Page | Package / Case | Write Cycle Time - Word, Page [custom] | Write Cycle Time - Word, Page [custom] | Package / Case | Package / Case |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
GigaDevice Semiconductor (HK) Limited | 125 °C | -40 °C | 133 MHz | 8-USON (3x4) | SPI - Quad I/O | 3.6 V | 2.7 V | 8 M | 7 ns | 8 MB | Non-Volatile | Surface Mount | FLASH - NOR (SLC) | FLASH | 4 ms 140 µs | 8-UDFN Exposed Pad | ||||
GigaDevice Semiconductor (HK) Limited | 85 C | -40 ¯C | 133 MHz | 8-USON (3x4) | SPI - Quad I/O | 3.6 V | 2.7 V | 8 M | 7 ns | 8 MB | Non-Volatile | Surface Mount | FLASH - NOR (SLC) | FLASH | 8-UDFN Exposed Pad | 70 µs | 2.4 ms | |||
GigaDevice Semiconductor (HK) Limited | 105 °C | -40 °C | 133 MHz | 8-SOP | SPI - Quad I/O | 3.6 V | 2.7 V | 8 M | 7 ns | 8 MB | Non-Volatile | Surface Mount | FLASH - NOR (SLC) | FLASH | 4 ms 140 µs | 8-SOIC | 0.154 in | 3.9 mm | ||
GigaDevice Semiconductor (HK) Limited | 125 °C | -40 °C | 133 MHz | 8-WSON (5x6) | SPI - Quad I/O | 3.6 V | 2.7 V | 8 M | 7 ns | 8 MB | Non-Volatile | Surface Mount | FLASH - NOR (SLC) | FLASH | 4 ms 140 µs | 8-WDFN Exposed Pad | ||||
GigaDevice Semiconductor (HK) Limited | 85 C | -40 ¯C | 133 MHz | 24-TFBGA (6x8) | SPI - Quad I/O | 3.6 V | 2.7 V | 8 M | 7 ns | 8 MB | Non-Volatile | Surface Mount | FLASH - NOR (SLC) | FLASH | 24-TBGA | 70 µs | 2.4 ms | |||
GigaDevice Semiconductor (HK) Limited | 105 °C | -40 °C | 120 MHz | 8-WSON (5x6) | SPI - Quad I/O | 3.6 V | 2.7 V | 8 M | 7 ns | 8 MB | Non-Volatile | Surface Mount | FLASH - NOR (SLC) | FLASH | 8-WDFN Exposed Pad | 60 µs | 4 ms | |||
GigaDevice Semiconductor (HK) Limited | 85 C | -40 ¯C | 133 MHz | 8-SOP | SPI - Quad I/O | 3.6 V | 2.7 V | 8 M | 7 ns | 8 MB | Non-Volatile | Surface Mount | FLASH - NOR (SLC) | FLASH | 8-SOIC | 70 µs | 2.4 ms | 0.154 in | 3.9 mm | |
GigaDevice Semiconductor (HK) Limited | 85 C | -40 ¯C | 120 MHz | 8-DIP | SPI - Quad I/O | 3.6 V | 2.7 V | 8 M | 8 MB | Non-Volatile | Surface Mount | FLASH - NOR | FLASH | 8-DIP | 50 µs | 2.4 ms | 0.26 in | 6.6 mm | ||
GigaDevice Semiconductor (HK) Limited | 85 C | -40 ¯C | 120 MHz | 16-SOP | SPI - Quad I/O | 3.6 V | 2.7 V | 8 M | 8 MB | Non-Volatile | Surface Mount | FLASH - NOR | FLASH | 16-SOIC | 50 µs | 2.4 ms | 0.295 " | 7.5 mm | ||
GigaDevice Semiconductor (HK) Limited | 125 °C | -40 °C | 133 MHz | 8-USON (4x4) | SPI - Quad I/O | 3.6 V | 2.7 V | 8 M | 7 ns | 8 MB | Non-Volatile | Surface Mount | FLASH - NOR (SLC) | FLASH | 4 ms 140 µs | 8-XDFN Exposed Pad |