SIP1X32 Series
Manufacturer: Amphenol ICC (FCI)
CONN SOCKET SIP 32POS GOLD
| Part | Termination Post Length | Termination Post Length | Material Flammability Rating | Contact Finish Thickness - Post | Contact Finish Thickness - Post | Housing Material | Termination | Mounting Type | Pitch - Mating | Pitch - Mating | Features | Contact Finish - Post | Contact Finish - Mating | Contact Finish Thickness - Mating | Contact Finish Thickness - Mating | Number of Positions or Pins (Grid) | Number of Positions or Pins (Grid) [custom] | Contact Material - Post [custom] | Contact Material - Mating | Pitch - Post | Pitch - Post | Type |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
Amphenol ICC (FCI) | 0.125 in | 3.18 mm | UL94 V-0 | 200 µin | 5.08 µm | Polyphenylene Sulfide (PPS) Glass Filled | Solder | Through Hole | 0.1 " | 2.54 mm | Closed Frame | Tin | Gold | 0.76 Ám | 30 Áin | 32 | 1 x 32 | Brass | Beryllium Copper | 0.1 in | 2.54 mm | SIP |
Amphenol ICC (FCI) | 0.125 in | 3.18 mm | UL94 V-0 | 200 µin | 5.08 µm | Polyphenylene Sulfide (PPS) Glass Filled | Solder | Through Hole | 0.1 " | 2.54 mm | Closed Frame | Tin-Lead | Gold | 0.76 Ám | 30 Áin | 32 | 1 x 32 | Brass | Beryllium Copper | 0.1 in | 2.54 mm | SIP |
Amphenol ICC (FCI) | 0.125 in | 3.18 mm | UL94 V-0 | 200 µin | 5.08 µm | Polyphenylene Sulfide (PPS) Glass Filled | Solder | Through Hole | 0.1 " | 2.54 mm | Closed Frame | Tin-Lead | Gold | 0.25 µm | 10 µin | 32 | 1 x 32 | Brass | Beryllium Copper | 0.1 in | 2.54 mm | SIP |
Amphenol ICC (FCI) | 0.125 in | 3.18 mm | UL94 V-0 | 200 µin | 5.08 µm | Polyphenylene Sulfide (PPS) Glass Filled | Solder | Through Hole | 0.1 " | 2.54 mm | Closed Frame | Tin-Lead | Tin-Lead | 3.81 Ám | 150 Áin | 32 | 1 x 32 | Brass | Beryllium Copper | 0.1 in | 2.54 mm | SIP |