BDN10 Series
Manufacturer: CTS Thermal Management Products
HEATSINK CPU W/ADHESIVE 1.01"SQ
| Part | Shelf Life | Length [x] | Length [x] | Thermal Resistance @ Natural | Material | Attachment Method | Width [x] | Width | Shape | Fin Height [custom] | Fin Height | Material Finish | Type | Package Cooled | Thermal Resistance @ Forced Air Flow | Fin Height [z] | Fin Height [z] |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
CTS Thermal Management Products | 24 Months | 1.01 in | 25.65 mm | 26.4 °C/W | Aluminum | Thermal Tape Adhesive (Included) | 1.01 " | 25.65 mm | Pin Fins Square | 0.355 in | 9.02 mm | Black Anodized | Top Mount | ASIC BGA CPU LGA | 8 °C/W | ||
CTS Thermal Management Products | 24 Months | 1.01 in | 25.65 mm | 20.8 °C/W | Aluminum | Thermal Tape Adhesive (Included) | 1.01 " | 25.65 mm | Pin Fins Square | Black Anodized | Top Mount | ASIC BGA CPU LGA | 6.3 °C/W | 14.1 mm | 0.555 in |