1.25mm Pitch Duo-Clasp Wire-to-Board PCB Receptacle, Dual Row, Vertical, 0.10µm Gold (Au) Plating, 40 Circuits
1.25mm Pitch Duo-Clasp Wire-to-Board PCB Receptacle, Dual Row, Vertical, 0.10µm Gold (Au) Plating, 40 Circuits
1.25mm Pitch Duo-Clasp Wire-to-Board PCB Receptacle, Dual Row, Vertical, 0.10µm Gold (Au) Plating, 40 Circuits
| Part | Contact Material | Insulation Material | Applications | Contact Finish Thickness - Post | Contact Finish Thickness - Post | Number of Positions Loaded | Connector Type | Insulation Color | Number of Positions | Fastening Type | Pitch - Mating | Pitch - Mating | Termination | Features | Style | Material Flammability Rating | Number of Rows [custom] | Operating Temperature [Max] | Operating Temperature [Min] | Contact Finish - Mating | Contact Type | Mounting Type | Contact Finish - Post | Insulation Height [z] | Insulation Height [z] | Contact Finish Thickness - Mating | Contact Finish Thickness - Mating | Voltage Rating |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
 Molex | Copper Alloy | Nylon Polyamide (PA) | General Purpose | 39.4 çin | 1 çm | All | Receptacle | Natural | 20 | Detent Lock | 0.049 in | 1.25 mm | Solder | Pick and Place Solder Retention | Board to Cable/Wire | UL94 V-0 | 2 | 85 °C | -25 °C | Gold | Forked | Surface Mount | Tin | 8.8 mm | 0.346 in | 3.9 µin | 0.099 µm | 50 V |
Molex | All | Receptacle | Natural | 40 | Detent Lock | 0.049 in | 1.25 mm | Solder | Pick and Place Solder Retention | Board to Cable/Wire | UL94 V-0 | 2 | 85 °C | -25 °C | Gold | Forked | Surface Mount | Tin | 8.8 mm | 0.346 in | 3.9 µin | 0.099 µm | 50 V |