87849 Series

Catalog

CONN HEADER SMD 50POS 1.27MM

Part	Contact Length - Mating	Contact Length - Mating	Insulation Color	Mounting Type	Contact Finish Thickness - Post	Contact Finish Thickness - Post	Mated Stacking Heights	Shrouding	Number of Rows	Number of Positions	Operating Temperature [Max]	Operating Temperature [Min]	Contact Type	Contact Finish - Post	Fastening Type	Material Flammability Rating	Termination	Number of Positions Loaded	Contact Finish - Mating	Insulation Height	Insulation Height	Contact Finish Thickness - Mating	Contact Finish Thickness - Mating	Pitch - Mating	Pitch - Mating	Connector Type	Row Spacing - Mating	Row Spacing - Mating	Contact Shape	Features	Contact Material	Style
Amphenol ICC (FCI) 87849-125LF	0.13 in	3.3 mm	Natural	Surface Mount	2.54 µm	100 µin	6.42 mm	Shrouded - 4 Wall	2	50	130 °C	-55 °C	Male Pin	Tin	Push-Pull	UL94 V-0	Solder	All	Gold or Gold GXT™	0.226 in	5.74 mm	30 Áin	0.76 Ám	0.05 in	1.27 mm	Header	0.05 in	1.27 mm	Square
Amphenol ICC (FCI) 87849-150	0.13 in	3.3 mm	Natural	Surface Mount	2.54 µm	100 µin	6.42 mm	Shrouded - 4 Wall	2	100	130 °C	-55 °C	Male Pin	Tin-Lead	Push-Pull	UL94 V-0	Solder	All	Gold or Gold GXT™	0.226 in	5.74 mm	30 Áin	0.76 Ám	0.05 in	1.27 mm	Header	0.05 in	1.27 mm	Square
Amphenol ICC (FCI) 87849-110TRLF	0.13 in	3.3 mm	Natural	Surface Mount	2.54 µm	100 µin	6.42 mm	Shrouded - 4 Wall	2	20	130 °C	-55 °C	Male Pin	Tin	Push-Pull	UL94 V-0	Solder	All	Gold or Gold GXT™	0.226 in	5.74 mm	30 Áin	0.76 Ám	0.05 in	1.27 mm	Header	0.05 in	1.27 mm	Square	Pick and Place
Amphenol ICC (FCI) 87849-130LF	0.13 in	3.3 mm	Natural	Surface Mount	2.54 µm	100 µin	6.42 mm	Shrouded - 4 Wall	2	60	130 °C	-55 °C	Male Pin	Tin	Push-Pull	UL94 V-0	Solder	All	Gold or Gold GXT™	0.226 in	5.74 mm	30 Áin	0.76 Ám	0.05 in	1.27 mm	Header	0.05 in	1.27 mm	Square
Amphenol ICC (FCI) 87849-105TRLF	0.13 in	3.3 mm	Natural	Surface Mount	2.54 µm	100 µin	6.42 mm	Shrouded - 4 Wall	2	10	130 °C	-55 °C	Male Pin	Tin	Push-Pull	UL94 V-0	Solder	All	Gold or Gold GXT™	0.226 in	5.74 mm	30 Áin	0.76 Ám	0.05 in	1.27 mm	Header	0.05 in	1.27 mm	Square	Pick and Place
Amphenol ICC (FCI) 87849-110LF	0.13 in	3.3 mm	Natural	Surface Mount	2.54 µm	100 µin	6.42 mm	Shrouded - 4 Wall	2	20	130 °C	-55 °C	Male Pin	Tin	Push-Pull	UL94 V-0	Solder	All	Gold or Gold GXT™	0.226 in	5.74 mm	30 Áin	0.76 Ám	0.05 in	1.27 mm	Header	0.05 in	1.27 mm	Square
Amphenol ICC (FCI) 87849-115	0.13 in	3.3 mm	Natural	Surface Mount	2.54 µm	100 µin	6.42 mm	Shrouded - 4 Wall	2	30	130 °C	-55 °C	Male Pin	Tin-Lead	Push-Pull	UL94 V-0	Solder	All	Gold or Gold GXT™	0.226 in	5.74 mm	30 Áin	0.76 Ám	0.05 in	1.27 mm	Header	0.05 in	1.27 mm	Square
Amphenol ICC (FCI) 87849-105	0.13 in	3.3 mm	Natural	Surface Mount	2.54 µm	100 µin	6.42 mm	Shrouded - 4 Wall	2	10	130 °C	-55 °C	Male Pin	Tin-Lead	Push-Pull	UL94 V-0	Solder	All	Gold or Gold GXT™	0.226 in	5.74 mm	30 Áin	0.76 Ám	0.05 in	1.27 mm	Header	0.05 in	1.27 mm	Square
Amphenol ICC (FCI) 87849-125	0.13 in	3.3 mm	Natural	Surface Mount	2.54 µm	100 µin	6.42 mm	Shrouded - 4 Wall	2	50	130 °C	-55 °C	Male Pin	Tin-Lead	Push-Pull	UL94 V-0	Solder	All	Gold or Gold GXT™	0.226 in	5.74 mm	30 Áin	0.76 Ám	0.05 in	1.27 mm	Header	0.05 in	1.27 mm	Square
Amphenol ICC (FCI) 87849-120TRLF	0.13 in	3.3 mm	Natural	Surface Mount	2.54 µm	100 µin		Shrouded - 4 Wall	2	20	130 °C	-55 °C	Male Pin	Tin	Push-Pull	UL94 V-0	Solder	All	Gold or Gold GXT™	0.226 in	5.74 mm	3 µin	0.076 µm	0.05 in	1.27 mm	Header	0.05 in	1.27 mm	Square		Beryllium Copper	Board to Cable/Wire