W25Q80 Series
Manufacturer: Winbond Electronics
IC FLASH 8MBIT SPI/QUAD 8WSON
| Part | Supplier Device Package | Memory Format | Memory Type | Write Cycle Time - Word, Page | Memory Organization | Memory Size | Mounting Type | Voltage - Supply [Min] | Voltage - Supply [Max] | Clock Frequency | Technology | Package / Case | Operating Temperature [Max] | Operating Temperature [Min] | Memory Interface | Package / Case | Package / Case | Write Cycle Time - Word, Page [custom] | Write Cycle Time - Word, Page [custom] | Access Time | Supplier Device Package [x] | Supplier Device Package [y] | Package / Case |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
Winbond Electronics | 8-WSON (6x5) | FLASH | Non-Volatile | 3 ms | 1M x 8 | 1024 KB | Surface Mount | 2.3 V | 3.6 V | 104 MHz | FLASH - NOR | 8-WDFN Exposed Pad | 85 C | -40 ¯C | SPI - Quad I/O | ||||||||
Winbond Electronics | 8-SOIC | FLASH | Non-Volatile | 3 ms | 1M x 8 | 1024 KB | Surface Mount | 2.3 V | 3.6 V | 104 MHz | FLASH - NOR | 8-SOIC | 85 C | -40 ¯C | SPI - Quad I/O | 0.154 in | 3.9 mm | ||||||
Winbond Electronics | 8-WSON (6x5) | FLASH | Non-Volatile | 1M x 8 | 1024 KB | Surface Mount | 2.5 V | 3.6 V | 104 MHz | FLASH - NOR | 8-WDFN Exposed Pad | 85 C | -40 ¯C | SPI - Quad I/O | 50 µs | 3 ms | 6 ns | ||||||
Winbond Electronics | 8-WSON (6x5) | FLASH | Non-Volatile | 1M x 8 | 1024 KB | Surface Mount | 2.5 V | 3.6 V | 104 MHz | FLASH - NOR | 8-WDFN Exposed Pad | 105 °C | -40 °C | SPI - Quad I/O | 50 µs | 3 ms | 6 ns | ||||||
Winbond Electronics | 8-WSON (6x5) | FLASH | Non-Volatile | 3 ms | 1M x 8 | 1024 KB | Surface Mount | 2.7 V | 3.6 V | 104 MHz | FLASH - NOR | 8-WDFN Exposed Pad | 85 C | -40 ¯C | SPI - Quad I/O | ||||||||
Winbond Electronics | FLASH | Non-Volatile | 1M x 8 | 1024 KB | 2.5 V | 3.6 V | 104 MHz | FLASH - NOR | SPI - Quad I/O | 50 µs | 3 ms | 6 ns | |||||||||||
Winbond Electronics | 8-VSOP | FLASH | Non-Volatile | 3 ms | 1M x 8 | 1024 KB | Surface Mount | 2.3 V | 3.6 V | 104 MHz | FLASH - NOR | 8-SOIC | 85 C | -40 ¯C | SPI - Quad I/O | 0.154 in | 3.9 mm | ||||||
Winbond Electronics | 8-WLCSP | FLASH | Non-Volatile | 800 µs | 1M x 8 | 1024 KB | Surface Mount | 1.65 V | 1.95 V | 80 MHz | FLASH - NOR | 8-UFBGA WLCSP | 85 C | -40 ¯C | SPI - Quad I/O | 1.41 | 2.37 | ||||||
Winbond Electronics | 8-SOIC | FLASH | Non-Volatile | 3 ms | 1M x 8 | 1024 KB | Surface Mount | 2.7 V | 3.6 V | 104 MHz | FLASH - NOR | 8-SOIC | 85 C | -40 ¯C | SPI - Quad I/O | 0.209 in 5.3 mm | |||||||
Winbond Electronics | 8-VSOP | FLASH | Non-Volatile | 3 ms | 1M x 8 | 1024 KB | Surface Mount | 2.7 V | 3.6 V | 133 MHz | FLASH - NOR | 8-SOIC | 85 C | -40 ¯C | SPI - Quad I/O | 0.154 in | 3.9 mm |