SN74LVC1G18 Series

One of Two Noninverting Demultiplexer with 3-State Deselected Output

Catalog

One of Two Noninverting Demultiplexer with 3-State Deselected Output

Part	Type	Operating Temperature [Min]	Operating Temperature [Max]	Voltage Supply Source	Package / Case	Current - Output High, Low [y]	Current - Output High, Low [x]	Voltage - Supply [Max]	Voltage - Supply [Min]	Independent Circuits	Supplier Device Package	Mounting Type	Circuit [custom]	Circuit [custom]
Texas Instruments SN74LVC1G18YZPR	Demultiplexer	-40 °C	125 °C	Single Supply	6-XFBGA DSBGA	32 mA	32 mA	5.5 V	1.65 V	1	6-DSBGA	Surface Mount	1:2	1
Texas Instruments SN74LVC1G18DBVR	Demultiplexer	-40 °C	125 °C	Single Supply	SOT-23-6	32 mA	32 mA	5.5 V	1.65 V	1	SOT-23-6	Surface Mount	1:2	1
Texas Instruments SN74LVC1G18DBVRG4	Demultiplexer	-40 °C	125 °C	Single Supply	SOT-23-6	32 mA	32 mA	5.5 V	1.65 V	1	SOT-23-6	Surface Mount	1:2	1
Texas Instruments SN74LVC1G18DRYR	Demultiplexer	-40 °C	125 °C	Single Supply	6-UFDFN	32 mA	32 mA	5.5 V	1.65 V	1	6-SON (1.45x1)	Surface Mount	1:2	1
Texas Instruments SN74LVC1G18DCKRE4	Demultiplexer	-40 °C	125 °C	Single Supply	6-TSSOP SC-88 SOT-363	32 mA	32 mA	5.5 V	1.65 V	1	SC-70-6	Surface Mount	1:2	1
Texas Instruments SN74LVC1G18DCKRG4	Demultiplexer	-40 °C	125 °C	Single Supply	6-TSSOP SC-88 SOT-363	32 mA	32 mA	5.5 V	1.65 V	1	SC-70-6	Surface Mount	1:2	1
Texas Instruments SN74LVC1G18YZAR	Demultiplexer	-40 °C	125 °C	Single Supply	6-XFBGA DSBGA	32 mA	32 mA	5.5 V	1.65 V	1	6-DSBGA	Surface Mount	1:2	1
Texas Instruments SN74LVC1G18YEAR	Demultiplexer	-40 °C	125 °C	Single Supply	6-XFBGA DSBGA	32 mA	32 mA	5.5 V	1.65 V	1	6-DSBGA	Surface Mount	1:2	1
Texas Instruments SN74LVC1G18DCKR	Demultiplexer	-40 °C	125 °C	Single Supply	6-TSSOP SC-88 SOT-363	32 mA	32 mA	5.5 V	1.65 V	1	SC-70-6	Surface Mount	1:2	1
Texas Instruments SN74LVC1G18YEPR	Demultiplexer	-40 °C	125 °C	Single Supply	6-XFBGA DSBGA	32 mA	32 mA	5.5 V	1.65 V	1	6-DSBGA	Surface Mount	1:2	1

Catalog

One of Two Noninverting Demultiplexer with 3-State Deselected Output

Key Features

• Operating temperature from –40°C to +125°CSupports 5-V VCCoperationInputs accept voltages to 5.5 VSupports down translation to VCCMax tpdof 3.4 ns at 3.3 VLow power consumption, 10-µA max ICC±24-mA Output drive at 3.3 VTypical VOLP(output ground bounce)<0.8 V at VCC= 3.3 V, TA= 25°CTypical VOHV(output VOHundershoot)>2 V at VCC= 3.3 V, TA= 25°CIoffSupports live insertion, partial-power-down mode, and back-drive protectionLatch-up performance exceeds 100 mAPer JESD 78, Class IIESD protection exceeds JESD 222000-V Human-body model (A114-A)200-V machine model (A115-A)1000-V Charged-device model (C101)Operating temperature from –40°C to +125°CSupports 5-V VCCoperationInputs accept voltages to 5.5 VSupports down translation to VCCMax tpdof 3.4 ns at 3.3 VLow power consumption, 10-µA max ICC±24-mA Output drive at 3.3 VTypical VOLP(output ground bounce)<0.8 V at VCC= 3.3 V, TA= 25°CTypical VOHV(output VOHundershoot)>2 V at VCC= 3.3 V, TA= 25°CIoffSupports live insertion, partial-power-down mode, and back-drive protectionLatch-up performance exceeds 100 mAPer JESD 78, Class IIESD protection exceeds JESD 222000-V Human-body model (A114-A)200-V machine model (A115-A)1000-V Charged-device model (C101)

Description

This non-inverting demultiplexer is designed for 1.65-V to 5.5-V VCCoperation. The SN74LVC1G18 device is a 1-of-2 non-inverting demultiplexer with a 3-state output. This device buffers the data on input A and passes it to either output Y0 or Y1, depending on whether the state of the select (S) input is low or high, respectively. NanoFree™ package technology is a major breakthrough in IC packaging concepts, using the die as the package. This device is fully specified for partial-power-down applications using Ioff. The Ioffcircuitry disables the outputs, preventing damaging current backflow through the device when it is powered down. This non-inverting demultiplexer is designed for 1.65-V to 5.5-V VCCoperation. The SN74LVC1G18 device is a 1-of-2 non-inverting demultiplexer with a 3-state output. This device buffers the data on input A and passes it to either output Y0 or Y1, depending on whether the state of the select (S) input is low or high, respectively. NanoFree™ package technology is a major breakthrough in IC packaging concepts, using the die as the package. This device is fully specified for partial-power-down applications using Ioff. The Ioffcircuitry disables the outputs, preventing damaging current backflow through the device when it is powered down.